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0145AA

Neon Indicatiors (Neon, LED and Filament Lamps)

BULGIN

BULGIN COMPONENTS PLC

ACDBUC0145-HF

SMDSchottkyBarrierDiode

Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -AEC-Q101Qualified&PPAP.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

BES0145

InductiveSensors

BalluffBalluff Korea Ltd.

巴魯夫巴魯夫集團

CDBF0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0145-HF

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Termi

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent.(IR=0.1uAtyp.@VR=10V) Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Te

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR0145-HF

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. (IR=0.1uAtyp.@VR=10V) -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedpla

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBN0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method2

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU0145

SMDSchottkyBarrierDiode

Io=100mA VR=45Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent(IR=0.1uAtyp.@VR=10V). Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供應商型號品牌批號封裝庫存備注價格
24+
DIP
2700
全新原裝自家現(xiàn)貨優(yōu)勢!
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General
1935+
N/A
55
加我qq或微信,了解更多詳細信息,體驗一站式購物
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General
22+
NA
55
加我QQ或微信咨詢更多詳細信息,
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DINKLE
24+
68900
一站配齊 原盒原包現(xiàn)貨 朱S Q2355605126
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DINKLE
23+
6500
只做原裝正品現(xiàn)貨或訂貨假一賠十!
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Preci-Dip
23+
原廠封裝
17495
只做原裝只有原裝現(xiàn)貨實報
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TE泰科連接器
23+
接插件插座
10541
TEMOLEX原裝系列代理連接器QQ1304306553
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TE/泰科
24+
10377
原廠現(xiàn)貨渠道
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NSC
23+
SOP-14
1088
優(yōu)勢庫存
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TE/泰科
23+
646210
原廠授權(quán)代理,海外優(yōu)勢訂貨渠道??商峁┐罅繋齑?詳
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更多0145AA供應商 更新時間2025-1-17 15:29:00