10BJ8.5A中文資料順燁電子數(shù)據(jù)手冊PDF規(guī)格書

Features

For surface mounted applications in order to optimize board space

Low profile package

Built in strain relief

Glass p assivated j unction

Low inductance

Excellent clamping capability

1000W peak pulse power capability at 10/1000 μ s waveform,

r

epetition r ate (duty cycle): 0.01%

Fast response time

Typical I R less than 1 μ A above 12V

High Temperature soldering: 260℃/10 seconds at terminals

Plastic package has underwriters laboratory flammability 94V 0

Meets MSL level 1, per J STD 020

IEC61000 4 2 ESD 30KV Air, 30KV contact compliance

Applications

I/O interface

AC/DC power supply

Low frequency signal transmission line (RS232, RS485, etc.)