10SMB8.2A中文資料順燁電子數(shù)據(jù)手冊PDF規(guī)格書
10SMB8.2A規(guī)格書詳情
Features
For surface mounted applications in order to optimize board space
Low profile package
Built in strain relief
Glass p assivated j unction
Low inductance
Excellent clamping capability
1000W peak pulse power capability at 10/1000 μ s waveform,
r
epetition r ate (duty cycle): 0.01%
Fast response time
Typical I R less than 1 μ A above 12V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V 0
Meets MSL level 1, per J STD 020
IEC61000 4 2 ESD 30KV Air, 30KV contact compliance
Applications
I/O interface
AC/DC power supply
Low frequency signal transmission line (RS232, RS485, etc.)
