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1998J中文資料IXYS數(shù)據(jù)手冊(cè)PDF規(guī)格書

1998J
廠商型號(hào)

1998J

功能描述

INTEGRATED CIRCUITS DIVISION

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250.74 Kbytes

頁(yè)面數(shù)量

7 頁(yè)

生產(chǎn)廠商 IXYS Corporation
企業(yè)簡(jiǎn)稱

IXYS

中文名稱

IXYS Corporation官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-26 14:00:00

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1998J規(guī)格書詳情

Features

? Load Current up to 20Arms with 5°C/W Heat Sink

? 800VP Blocking Voltage

? 5mA Control Current

? Zero-Cross Switching

? Isolated, Low Thermal Impedance Ceramic Pad for

Heat Sink Applications

? 2500Vrms Isolation, Input to Output

? DC Control, AC Output

? Optically Isolated

? Low EMI and RFI Generation

? High Noise Immunity

? Flammability Rating UL 94 V-0

Applications

? Programmable Control

? Process Control

? Power Control Panels

? Remote Switching

? Gas Pump Electronics

? Contactors

? Large Relays

? Solenoids

? Motors

? Heaters

Approvals

? UL 508 Recognized Component: File E69938

Description

CPC1998J is an AC Solid State Switch utilizing dual

power SCR outputs. This device also includes

zero-cross turn-on circuitry and is specified with an

800VP blocking voltage.

Tightly controlled zero-cross circuitry ensures low

noise switching of AC loads by minimizing the

generation of transients. The optically coupled input

and output circuits provide exceptional noise immunity

and 2500Vrms of isolation between the control and the

output. As a result, the CPC1998J is well suited for

industrial environments where electromagnetic

interference would disrupt the operation of plant facility

communications and control systems.

The unique i4-PAC package pioneered by IXYS allows

Solid State Relays to achieve the highest load current

and power ratings. This package features a unique

IXYS process in which the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the traditional copper leadframe.

The DCB ceramic, the same substrate used in high

power modules, not only provides 2500Vrms isolation

but also very low junction-to-case thermal impedance

(0.35 °C/W)

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