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Features

The DLCC family of Ceramic Leadless Chip

Carrier packages for Diodes is designed for

all high reliability applications – Space,

Aerospace, High temperature and Military.

Detailed information

The DLCC package design takes full advantage of the proven

high reliability pedigree of the High Temperature Cofired

Ceramic (HTCC) surface mount packaging technology, which

is easily integrated for automated assembly. Semelab has

taken the existing standards for ceramic surface mount

package manufacture and added additional design features

to enhance thermal performance, to present a competitive

alternative for high reliability applications.