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1ST085EN1F43I2VLS1中文資料英特爾數(shù)據(jù)手冊PDF規(guī)格書

1ST085EN1F43I2VLS1
廠商型號

1ST085EN1F43I2VLS1

功能描述

Intel? Stratix? 10 TX Device Overview

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341.12 Kbytes

頁面數(shù)量

39

生產(chǎn)廠商 Intel Corporation(Integrated Electronics Corporation)
企業(yè)簡稱

Intel英特爾

中文名稱

英特爾(美國科技公司)官網(wǎng)

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更新時(shí)間

2024-11-15 11:18:00

1ST085EN1F43I2VLS1規(guī)格書詳情

Intel? Stratix? 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex? core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

? All new Intel Hyperflex? core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

? Intel 14 nm tri-gate (FinFET) technology

? Heterogeneous 3D System-in-Package (SiP) technology

? Monolithic core fabric with up to 2.8 million logic elements (LEs)

? Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

? Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

? Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

? Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

? Hard PCI Express? Gen3 x16 intellectual property (IP) blocks

? Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價(jià)格
Intel / Altera
20+
FBGA-1760
29860
Altera全新FPGA-可開原型號增稅票
詢價(jià)
24+
N/A
76000
一級代理-主營優(yōu)勢-實(shí)惠價(jià)格-不悔選擇
詢價(jià)
Intel
24+
1760-BBGA FCBGA
9350
獨(dú)立分銷商 公司只做原裝 誠心經(jīng)營 免費(fèi)試樣正品保證
詢價(jià)
INTEL/英特爾
23+
1760-BBGAFCBGA
1930
只做原裝,主打品牌QQ詢價(jià)有詢必回
詢價(jià)
23+
6000
現(xiàn)貨 有價(jià)可談
詢價(jià)