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1ST280EY3F50E3VGS1中文資料英特爾數(shù)據(jù)手冊PDF規(guī)格書

1ST280EY3F50E3VGS1
廠商型號

1ST280EY3F50E3VGS1

功能描述

Intel? Stratix? 10 TX Device Overview

文件大小

341.12 Kbytes

頁面數(shù)量

39

生產(chǎn)廠商 Intel Corporation
企業(yè)簡稱

Intel英特爾

中文名稱

英特爾官網(wǎng)

原廠標識
數(shù)據(jù)手冊

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更新時間

2025-1-19 14:16:00

1ST280EY3F50E3VGS1規(guī)格書詳情

Intel? Stratix? 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex? core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

? All new Intel Hyperflex? core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

? Intel 14 nm tri-gate (FinFET) technology

? Heterogeneous 3D System-in-Package (SiP) technology

? Monolithic core fabric with up to 2.8 million logic elements (LEs)

? Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

? Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

? Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

? Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

? Hard PCI Express? Gen3 x16 intellectual property (IP) blocks

? Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

供應商 型號 品牌 批號 封裝 庫存 備注 價格
INTEL
22+
N/A
820
原裝原裝原裝
詢價
TOSHIBA
0712+
TO92S
9842
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價
AGILENT
2339+
BGA
5642
公司原廠原裝現(xiàn)貨假一罰十!特價出售!強勢庫存!
詢價
TOSHIBA
2020+
TO-92S
12856
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
詢價
TOSHIBA
TO-92
608900
原包原標簽100%進口原裝常備現(xiàn)貨!
詢價
TOSHIBA
22+
TO92
25000
原裝現(xiàn)貨,價格優(yōu)惠,假一罰十
詢價
AGILENT
24+
BGA
6540
原裝現(xiàn)貨/歡迎來電咨詢
詢價
N/A
2023+
NA
80000
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品
詢價
AGILENT
23+
BGA金底
38
全新原裝正品現(xiàn)貨,支持訂貨
詢價
TOSHIBA/東芝
1701+
TO-92
8956
只做原裝現(xiàn)貨、主營光電元器件/門市現(xiàn)貨
詢價