首頁>1ST280EY3F50E3VGS1>規(guī)格書詳情
1ST280EY3F50E3VGS1中文資料英特爾數(shù)據(jù)手冊PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多- 1ST280EY1F50I3VXS1
- 1ST280EY2F50E1VGS1
- 1ST280EY2F50E1VLS1
- 1ST280EY2F50E1VXS1
- 1ST280EY2F50E2VGS1
- 1ST280EY2F50E2VLS1
- 1ST280EY2F50E2VXS1
- 1ST280EY2F50E3VGS1
- 1ST280EY2F50E3VLS1
- 1ST280EY2F50E3VXS1
- 1ST280EY2F50I1VGS1
- 1ST280EY2F50I1VLS1
- 1ST280EY2F50I1VXS1
- 1ST280EY2F50I2VGS1
- 1ST280EY2F50I2VLS1
- 1ST280EY2F50I2VXS1
- 1ST280EY2F50I3VGS1
- 1ST280EY2F50I3VLS1
1ST280EY3F50E3VGS1規(guī)格書詳情
Intel? Stratix? 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable
of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non
Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100
Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate
bandwidth, meeting the demanding transceiver bandwidth and power budget
specifications of next generation designs.
In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel
Stratix 10 TX devices feature several other breakthrough innovations. These include
all new HyperFlex? core architecture, hardened floating point DSP blocks, hardened
external memory controllers and advanced packaging technology based on Intel's
Embedded Multi-die Interconnect Bridge (EMIB).
With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)
available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,
application-class processing, and allow designers to extend hardware virtualization
into the FPGA fabric.
Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple
high-speed transceiver tiles, all inside a single flip-chip BGA package. This
implementation, combined with the unmatched transceiver bandwidth and core fabric
performance, demonstrates Intel's commitment to deliver high-performance
programmable solutions to your most challenging system design problems.
Important innovations in Intel Stratix 10 TX devices include:
? All new Intel Hyperflex? core architecture delivering 2X the core performance
compared to previous generation high-performance FPGAs
? Intel 14 nm tri-gate (FinFET) technology
? Heterogeneous 3D System-in-Package (SiP) technology
? Monolithic core fabric with up to 2.8 million logic elements (LEs)
? Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles
? Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,
chip-to-module, and backplane applications
? Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM
memory blocks
? Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops
(PLLs)
? Hard PCI Express? Gen3 x16 intellectual property (IP) blocks
? Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ
signals (528, 514) and PAM4 signals (544, 514)
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
INTEL |
22+ |
N/A |
820 |
原裝原裝原裝 |
詢價 | ||
TOSHIBA |
0712+ |
TO92S |
9842 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價 | ||
AGILENT |
2339+ |
BGA |
5642 |
公司原廠原裝現(xiàn)貨假一罰十!特價出售!強勢庫存! |
詢價 | ||
TOSHIBA |
2020+ |
TO-92S |
12856 |
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可 |
詢價 | ||
TOSHIBA |
TO-92 |
608900 |
原包原標簽100%進口原裝常備現(xiàn)貨! |
詢價 | |||
TOSHIBA |
22+ |
TO92 |
25000 |
原裝現(xiàn)貨,價格優(yōu)惠,假一罰十 |
詢價 | ||
AGILENT |
24+ |
BGA |
6540 |
原裝現(xiàn)貨/歡迎來電咨詢 |
詢價 | ||
N/A |
2023+ |
NA |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 | ||
AGILENT |
23+ |
BGA金底 |
38 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
TOSHIBA/東芝 |
1701+ |
TO-92 |
8956 |
只做原裝現(xiàn)貨、主營光電元器件/門市現(xiàn)貨 |
詢價 |