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1ST280EY3F50I1VLS1中文資料英特爾數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

1ST280EY3F50I1VLS1
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1ST280EY3F50I1VLS1

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Intel? Stratix? 10 TX Device Overview

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341.12 Kbytes

頁(yè)面數(shù)量

39 頁(yè)

生產(chǎn)廠商 Intel Corporation(Integrated Electronics Corporation)
企業(yè)簡(jiǎn)稱

Intel英特爾

中文名稱

英特爾(美國(guó)科技公司)官網(wǎng)

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更新時(shí)間

2024-11-15 18:36:00

1ST280EY3F50I1VLS1規(guī)格書(shū)詳情

Intel? Stratix? 10 TX FPGAs feature power-efficient, dual-mode transceivers, capable

of both 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non

Return to Zero) operation. Supported by hardened PCI Express Gen 3 and 10/25/100

Gbps Ethernet MAC IP blocks, these devices can deliver over 8 Tbps of aggregate

bandwidth, meeting the demanding transceiver bandwidth and power budget

specifications of next generation designs.

In addition to the 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers, Intel

Stratix 10 TX devices feature several other breakthrough innovations. These include

all new HyperFlex? core architecture, hardened floating point DSP blocks, hardened

external memory controllers and advanced packaging technology based on Intel's

Embedded Multi-die Interconnect Bridge (EMIB).

With an embedded quad-core 64-bit Arm* Cortex*-A53 hard processor system (HPS)

available in select devices, Intel Stratix 10 TX FPGAs deliver power efficient,

application-class processing, and allow designers to extend hardware virtualization

into the FPGA fabric.

Intel Stratix 10 TX FPGAs integrate a monolithic 14 nm FPGA fabric die with multiple

high-speed transceiver tiles, all inside a single flip-chip BGA package. This

implementation, combined with the unmatched transceiver bandwidth and core fabric

performance, demonstrates Intel's commitment to deliver high-performance

programmable solutions to your most challenging system design problems.

Important innovations in Intel Stratix 10 TX devices include:

? All new Intel Hyperflex? core architecture delivering 2X the core performance

compared to previous generation high-performance FPGAs

? Intel 14 nm tri-gate (FinFET) technology

? Heterogeneous 3D System-in-Package (SiP) technology

? Monolithic core fabric with up to 2.8 million logic elements (LEs)

? Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

? Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip,

chip-to-module, and backplane applications

? Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM

memory blocks

? Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops

(PLLs)

? Hard PCI Express? Gen3 x16 intellectual property (IP) blocks

? Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ

signals (528, 514) and PAM4 signals (544, 514)

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
TOSHIBA/東芝
2048+
TO-92S
9852
只做原裝正品現(xiàn)貨!或訂貨假一賠十!
詢價(jià)
2017+
NA
28562
只做原裝正品假一賠十!
詢價(jià)
AGILENT
2339+
BGA
5642
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢(shì)庫(kù)存!
詢價(jià)
INTEL/英特爾
23+
2912-BBGA
3000
一級(jí)代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
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AGILENT
21+
BGA金底
38
原裝現(xiàn)貨假一賠十
詢價(jià)
INTEL/英特爾
23+
2912-BBGAFCBGA
1930
只做原裝,主打品牌QQ詢價(jià)有詢必回
詢價(jià)
N/A
21+
NA
35200
一級(jí)代理/放心采購(gòu)
詢價(jià)
24+
1
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MOLEX/莫仕
2420+
/
425047
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HP
99
8
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