3-134-804中文資料碩特數(shù)據(jù)手冊PDF規(guī)格書

Technical Data

Rated Voltage up to 60 VDC

Breaking Capacity up to 400 A

Mounting PCB,SMT

Tripping temperature >175°C or >210°C

Material: Housing Plastics

Material: Terminals Copper alloy, tin-plated

Unit Weight 0.75 g

Storage Conditions 0 °C to 40 °C, max. 70 r.h.

Product Marking Variant Code, Lot no.

Activation force Fa = max. 50 N

Activation distance Sa = 1.1 +0.3/-0.1 mm

Maximum reflow temperature 260 °C (peak)

Soldering Methods Reflow

Soldering Profile

Solderability JESD22-B102E, Method 1

Resistance to Soldering Heat JEDEC J-STD-020

Moisture Sensitivity Level MSL 1, J-STD-020

Damp heat, steady state MIL-STD-202, Method 103

Thermal Shock MIL-STD-202, Method 107

Operational Life MIL-STD-202, Method 108 Condition D

Vibration, High Frequency MIL-STD-202, Method 204 Condition D

Mechanical Shock MIL-STD-202, Method 213 Condition B

Resistance to Solvents MIL-STD-202, Method 215

Temperature Cycling JESD22, Method JA-104 Condition G

Flame Retardance AEC-Q200-001 + SAG Specification

Board Flex AEC-Q200-005

Terminal Strength AEC-Q200-006