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BPF-A355+

BandpassFilter

MINI

Mini-Circuits

BUZ355

SIPMOSPowerTransistor(NchannelEnhancementmodeAvalanche-rated)

SIPMOS?PowerTransistor ?Nchannel ?Enhancementmode ?Avalanche-rated

SIEMENSSiemens Semiconductor Group

西門子德國西門子股份公司

BUZ355

Enhancementmode

Nchannel Enhancementmode Avalanche-rated

NJSEMINew Jersey Semi-Conductor Products, Inc.

新澤西半導(dǎo)體新澤西半導(dǎo)體產(chǎn)品股份有限公司

BUZ355

iscN-ChannelMOSFETTransistor

FEATURES ·DrainCurrent:ID=6.0A@TC=25℃ ·DrainSourceVoltage :VDSS=800V(Min) ·StaticDrain-SourceOn-Resistance :RDS(on)=1.5Ω(Max)@VGS=10V ·100avalanchetested ·MinimumLot-to-Lotvariationsforrobustdevice performanceandreliableoperation DESCRIPTION ·motordrive,

ISCInchange Semiconductor Company Limited

無錫固電無錫固電半導(dǎo)體股份有限公司

CASD355SG

100V/100mASURFACEMOUNTSWITCHINGDIODE

CYSTEKECCystech Electonics Corp.

全宇昕科技全宇昕科技股份有限公司

CASD355SY

80V/100mASURFACEMOUNTSWITCHINGDIODE

CYSTEKECCystech Electonics Corp.

全宇昕科技全宇昕科技股份有限公司

CDSF355

SMDSwitchingDiode

HighSpeed Features Designedformountingonsmallsurface. Highspeedswitching. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,m

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355B

SMDSwitchingDiode

HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Gol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355B-HF

SMDSwitchingDiode

HighSpeed Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDSF355BS-HF

SMDSwitchingDiode

RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplas

COMCHIPComchip Technology

典琦典琦科技股份有限公司

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加我QQ或微信咨詢更多詳細信息,
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