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4-G2300-XX中文資料TDK株式會(huì)社數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

4-G2300-XX
廠商型號(hào)

4-G2300-XX

功能描述

MEMS Gyroskop, Digitalnl, Vybocenl, ± 300°/s, 4.75 V, 5.25 V, LCC

文件大小

2.00604 Mbytes

頁(yè)面數(shù)量

22 頁(yè)

生產(chǎn)廠商 TDK Corporation
企業(yè)簡(jiǎn)稱

TDKTDK株式會(huì)社

中文名稱

東電化(中國(guó))投資有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-1-6 15:19:00

4-G2300-XX規(guī)格書(shū)詳情

General Description

GYPRO? product line is an established family of Micro-Electro-Mechanical Systems (MEMS) angular rate sensor specifically designed for demanding applications.

The MEMS transducer is manufactured using Tronics proprietary vacuum wafer-level packaging technology based on micro-machined thick single crystal silicon.

The integrated circuit (IC) provides a stable primary anti-phase vibration of the ‘drive’ proof masses, thanks to electrostatic comb drives. When the sensor is subjected to a rotation, the Coriolis force acts on the ‘sense’ proof masses and forces them into a secondary anti-phase movement perpendicular to the direction of drive vibration, which is itself counter-balanced by electrostatic forces. The sense closed loop operates as an electromechanical ΣΔ modulator providing a digital output. This output is finally demodulated using the drive reference signal.

The sensor is factory calibrated and compensated for temperature effects to provide high-accuracy digital output over a broad temperature range.

Raw data output can be also chosen to enable customer-made compensations.

Features

? Digital angular rate sensor with SPI interface

? Angular rate measurement around Z-axis (yaw)

? ±300°/sec input range

? Ultra low noise

? Excellent bias instability

? 24 bit angular rate output

? Embedded temperature sensor for on-chip or external temperature compensation

? Built-in Self-Test

? 5V single supply voltage

? Low operating current consumption: 25mA

? CLCC 30 package: 19.6 mm x 11.5 mm x 2.9 mm

? Weight : 2 grams

? REACH and RoHS compatible

Applications

? Precision instrumentation

? Platform stabilization and control

? Unmanned aerial vehicles

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