4406

包裝：袋 類別：盒子，外殼，機架 手柄 描述：BL.666, GEAR LEVER HANDLES, DURO

Elesa USA Corporation

4406

包裝：散裝 類別：電路保護 保險絲座 描述：FUSE BLOCK CART 250V 30A CHASSIS

Eaton - Electronics Division

4406

包裝：袋 類別：盒子，外殼，機架 手柄 描述：BL.666, GEAR LEVER HANDLES, DURO

Elesa USA Corporation

44065

Inductive Sensor

Features ■M12×1threadedbarrel ■Chrome-platedbrass ■DC2-wire,10…65VDC ■NOcontact ■M12x1maleconnector Functionalprinciple Inductivesensorsdetectmetalobjects contactlessandwear-free.Forthis,theyusea high-frequencyelectromagneticACfieldthat interactswiththetar

4406551

Inductive Sensor

Features ■M12×1threadedbarrel ■Chrome-platedbrass ■DC2-wire,10…65VDC ■NCcontact ■Cableconnection Functionalprinciple Inductivesensorsdetectmetalobjects contactlessandwear-free.Forthis,theyusea high-frequencyelectromagneticACfieldthat interactswiththetarget.I

44067

Inductive Sensor

Features ■M12×1threadedbarrel ■Chrome-platedbrass ■DC2-wire,10…65VDC ■NOcontact ■M12x1maleconnector Functionalprinciple Inductivesensorsdetectmetalobjects contactlessandwear-free.Forthis,theyusea high-frequencyelectromagneticACfieldthat interactswiththetar

4406701

Inductive Sensor

Features ■M12×1threadedbarrel ■Chrome-platedbrass ■DC2-wire,10…65VDC ■NOcontact ■M12x1maleconnector Functionalprinciple Inductivesensorsdetectmetalobjects contactlessandwear-free.Forthis,theyusea high-frequencyelectromagneticACfieldthat interactswiththetar

4406A

30V N-Channel MOSFET

GeneralDescription TheAO4406AusesadvancedtrenchtechnologytoprovideexcellentRDS(ON)withlowgatecharge.ThisdeviceissuitableforhighsideswitchinSMPSandgeneralpurposeapplications. ProductSummary VDS30V ID(atVGS=10V)13A RDS(ON)(atVGS=10V)

44060

PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins

4406000400

We are Dedicated to Achieving Customer Satisfaction Through Continuous Improvement

44067-0201

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

44067-0401

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

44067-0402

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

44067-0403

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

44067-0601

3.00mm (.118) Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating

44067-0602

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm

44067-0603

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

44067-0801

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)

44067-0802

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick

44067-1001

3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)