首頁 >570E190U09B>規(guī)格書列表
| 零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
|---|---|---|---|---|
570E190U09B | EMI-RFII Crimp-Ring Micro-D Backshell Assembly | GLENAIR Glenair, Inc. | GLENAIR |
詳細參數(shù)
- 型號：
570E190U09B
- 制造商：
GLENAIR
- 制造商全稱：
Glenair, Inc.
- 功能描述：
EMI-RFII Crimp-Ring Micro-D Backshell Assembly
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
SILICON LABS(芯科) |
23+ |
SMD70508P |
7350 |
現(xiàn)貨供應,當天可交貨!免費送樣,原廠技術(shù)支持!!! |
詢價 | ||
24+ |
N/A |
73000 |
一級代理-主營優(yōu)勢-實惠價格-不悔選擇 |
詢價 | |||
SILICON LABS(芯科) |
21+ |
SMD-8 |
4500 |
航宇科工半導體-央企合格優(yōu)秀供方 |
詢價 |
更多570E190U09B供應商
更新時間2024-12-25 11:35:00
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