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5962R1722002PYE中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書

5962R1722002PYE
廠商型號(hào)

5962R1722002PYE

功能描述

TPS7H2201-SP and TPS7H2201-SEP Radiation Hardened 1.5V to 7V, 6A eFuse

絲印標(biāo)識(shí)

1722002PYE

封裝外殼

HTSSOP

文件大小

2.70016 Mbytes

頁面數(shù)量

51

生產(chǎn)廠商 Texas Instruments
企業(yè)簡(jiǎn)稱

TI1德州儀器

中文名稱

德州儀器官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-5 16:16:00

5962R1722002PYE規(guī)格書詳情

1 Features

? Standard micro circuit available, SMD

5962R17220

? Vendor item drawing available, VID V62/23608

? Radiation performance:

– Radiation hardness assurance (RHA) up to TID

100krad(Si)

– Single event latchup (SEL), single event

burnout (SEB), and single event gate rupture

(SEGR) immune to LET = 75MeV-cm2/mg

– SEFI/SET characterized to

LET = 75MeV-cm2/mg

? Integrated single channel eFuse

? Input voltage range: 1.5V to 7V

? Low on-resistance (RON) of :

– 35mΩ maximum at 25°C and VIN = 5V for CFP

and KGD

– 23mΩ maximum at 25°C and VIN = 5V for

HTSSOP

? 6-A maximum continuous switch current

? Low control input threshold enables use of

1.2, 1.8, 2.5, and 3.3V logic

? Configurable rise time (soft start)

? Reverse current protection

? Programmable and internal current limiting

(fast-trip)

? Programmable fault timer (current limit and

retry modes)

? Thermal shutdown

? Ceramic and plastic package with thermal pad

2 Applications

? Space satellite power management and

distribution

? Radiation hardened and tolerant power tree

applications

? Available in military (–55°C to 125°C) temperature

range

3 Description

The TPS7H2201 is a single channel eFuse that

provides configurable rise time to minimize inrush

current and reverse current protection. The device

contains a P-channel MOSFET that can operate over

an input voltage range of 1.5V to 7V and can support

a maximum continuous current of 6A. The switch

is controlled by an on and off input (EN), which is

capable of interfacing directly with low-voltage control

signals.

The TPS7H2201 is available in a ceramic and plastic

package with integrated thermal pad allowing for high

power dissipation. The device is characterized for

operation over the free-air temperature range of

–55°C to 125°C.

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