首頁(yè)>638-026-230-048>規(guī)格書(shū)詳情
638-026-230-048中文資料亞得電子數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)
| 廠商型號(hào) |
638-026-230-048 |
| 功能描述 | 638 Series,D-Sub Connectors | Vertical High Density | PCB Mount | Metal Body | Receptacle |
| 文件大小 |
103.31 Kbytes |
| 頁(yè)面數(shù)量 |
1 頁(yè) |
| 生產(chǎn)廠商 | EDAC, All Rights Reserved. |
| 企業(yè)簡(jiǎn)稱(chēng) |
EDAC【亞得電子】 |
| 中文名稱(chēng) | 亞得電子（東莞）有限公司官網(wǎng) |
| 原廠標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-1-30 15:00:00 |
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Features
Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes
Pin and Socket Contact Mating Design with P.C. Tail Termination
Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention
Grounding Features include Boardlock for Exceptional Retention to P.C. Board
Mounting Options for Panel Mount or Connector Mating include Through Hole, Threaded Hole and Threaded Standoffs
D-Shaped Connector Mating Outline provides Polarization
Design based on Requirements of MIL-C-24038, EIA RS-232 and RS-449
High Profile available in Receptacle only
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
IR |
23+ |
GA-CHIPSWAFERS |
8000 |
只做原裝現(xiàn)貨 |
詢(xún)價(jià) | ||
IR |
23+ |
GA-CHIPSWAFERS |
7000 |
詢(xún)價(jià) | |||
EDAC |
20+ |
連接器 |
493 |
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件! |
詢(xún)價(jià) | ||
IR |
22+ |
GA-CHIPS&WAFERS |
6000 |
終端可免費(fèi)供樣,支持BOM配單 |
詢(xún)價(jià) | ||
MOLEX/莫仕 |
24+ |
37214 |
原廠現(xiàn)貨渠道 |
詢(xún)價(jià) | |||
EDAC |
22+ |
NA |
168 |
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詢(xún)價(jià) |
