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87761

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

ProductDescription HighTemperatureElectronic,2Conductor22AWG(7x30)TinnedCopper,FEPInsulation,OverallBeldfoil?Shield,PVDFOuterJacket,CMP

BELDENBelden Inc.

百通電纜設(shè)計科技有限公司

87761.0021000

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

ProductDescription HighTemperatureElectronic,2Conductor22AWG(7x30)TinnedCopper,FEPInsulation,OverallBeldfoil?Shield,PVDFOuterJacket,CMP

BELDENBelden Inc.

百通電纜設(shè)計科技有限公司

87761.002500

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

ProductDescription HighTemperatureElectronic,2Conductor22AWG(7x30)TinnedCopper,FEPInsulation,OverallBeldfoil?Shield,PVDFOuterJacket,CMP

BELDENBelden Inc.

百通電纜設(shè)計科技有限公司

87761.0025000

Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP

ProductDescription HighTemperatureElectronic,2Conductor22AWG(7x30)TinnedCopper,FEPInsulation,OverallBeldfoil?Shield,PVDFOuterJacket,CMP

BELDENBelden Inc.

百通電纜設(shè)計科技有限公司

87761-2001

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關(guān)m (30關(guān)) Gold (Au) Selective Plating

MOLEX10Molex Electronics Ltd.

莫仕

87761-2400

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關(guān)m (30關(guān)) Gold (Au) Selective Plating

MOLEX10Molex Electronics Ltd.

莫仕

87761-4408

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關(guān)m (30關(guān)) Gold (Au) Selective Plating, 12.50mm (.492) Stacking

MOLEX10Molex Electronics Ltd.

莫仕

87761-5001

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關(guān)m (30關(guān)) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height

MOLEX10Molex Electronics Ltd.

莫仕

87761-5021

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height

MOLEX10Molex Electronics Ltd.

莫仕

87761-5022

2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關(guān)m (15關(guān)) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height

MOLEX10Molex Electronics Ltd.

莫仕

詳細(xì)參數(shù)

  • 型號：

    87761

  • 制造商：

    MOLEX

  • 制造商全稱：

    Molex Electronics Ltd.

  • 功能描述：

    2.00mm(.079) Pitch Milli-Grid? Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm(30μ) Gold(Au) Selective Plating

供應(yīng)商型號品牌批號封裝庫存備注價格
Belden
22+
NA
80
加我QQ或微信咨詢更多詳細(xì)信息,
 詢價
MOLEX/莫仕
24+
19405
原廠現(xiàn)貨渠道
 詢價
MOLEX
24+
con
35960
查現(xiàn)貨到京北通宇商城
 詢價
MOLEX/莫仕
2508+
/
226570
一級代理，原裝現(xiàn)貨
 詢價
Molex
24+
connector
16291
專注Molex品牌原裝正品代理分銷,認(rèn)準(zhǔn)水星電子
 詢價
MOLEX/莫仕
23+
16PIN
5000
原廠授權(quán)代理,海外優(yōu)勢訂貨渠道?？商峁┐罅繋齑?詳
 詢價
更多87761供應(yīng)商 更新時間2025-4-22 10:08:00

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