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88W8987-A2-EAHE/AZ中文資料恩智浦?jǐn)?shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

88W8987-A2-EAHE/AZ
廠(chǎng)商型號(hào)

88W8987-A2-EAHE/AZ

功能描述

2.4/5 GHz Dual-band 1x1 Wi-Fi 5 (802.11ac) and Bluetooth 5.2 Solution

文件大小

1.08483 Mbytes

頁(yè)面數(shù)量

89 頁(yè)

生產(chǎn)廠(chǎng)商 NXP Semiconductors
企業(yè)簡(jiǎn)稱(chēng)

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中文名稱(chēng)

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更新時(shí)間

2025-1-13 20:00:00

88W8987-A2-EAHE/AZ規(guī)格書(shū)詳情

The 88W8987 is a highly integrated Wi-Fi (2.4/5 GHz) and Bluetooth single-chip solution,

specifically designed to support the speed, reliability, and quality requirements of next

generation Very High Throughput (VHT) products.

The System-on-Chip (SoC) provides both simultaneous and independent operation of the

following:

? IEEE 802.11ac (Wave 2), 1x1 with data rates up to MCS9 (433 Mbit/s)

? Bluetooth 5.2 (includes Bluetooth Low Energy (LE))

The SoC also provides:

? Bluetooth Classic and Bluetooth LE dual (Smart Ready) operation

? Wi-Fi indoor location positioning (802.11mc)

For security, the device supports high performance 802.11i security standards through

implementation of the Advanced Encryption Standard (AES)/Counter Mode CBCMAC

Protocol (CCMP), AES/Galois/Counter Mode Protocol (GCMP), AES/Cipher-

Based Message Authentication Code (CMAC), and WLAN Authentication and Privacy

Infrastructure (WAPI) security mechanisms.

For video, voice, and multimedia applications, 802.11e Quality of Service (QoS) is

supported. The device also supports 802.11h Dynamic Frequency Selection (DFS) for

detecting radar pulses when operating in the 5 GHz range.

Host interfaces include SDIO 3.0 and high-speed UART interfaces for connecting Wi-Fi

and Bluetooth technologies to the host processor.

The device is designed with two front-end configurations to accommodate Wi-Fi and

Bluetooth on either separate or shared paths:

? 2-antenna configuration—1x1 Wi-Fi and Bluetooth on separate paths (QFN)

? 1-antenna configuration—1x1 Wi-Fi and Bluetooth on shared paths (eWLP)

The following figures show the application diagrams for each package option.

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
MARVELL
23+
NA/
45
優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票
詢(xún)價(jià)
NXP Semiconductors
20+
QFN-68
29860
RF片上系統(tǒng)SOC-可開(kāi)原型號(hào)增稅票
詢(xún)價(jià)
21+
BGA
80000
NXP現(xiàn)貨庫(kù)存,終端可拆樣品
詢(xún)價(jià)
Marvell
16+
BGA
94
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力
詢(xún)價(jià)
Marvell
21+
BGA
94
原裝現(xiàn)貨假一賠十
詢(xún)價(jià)
Marvell
23+
BGA
30000
代理原裝現(xiàn)貨,價(jià)格優(yōu)勢(shì)
詢(xún)價(jià)
NXP
589220
16余年資質(zhì) 絕對(duì)原盒原盤(pán) 更多數(shù)量
詢(xún)價(jià)
NXP
24+
83-WFBGA
48558
專(zhuān)注原裝正品代理分銷(xiāo),認(rèn)準(zhǔn)水星電子
詢(xún)價(jià)
NXP
24+
HVQFN
10000
一級(jí)代理保證進(jìn)口原裝正品現(xiàn)貨假一罰十價(jià)格合理
詢(xún)價(jià)
NXP
22+23+
HVQFN
8000
新到現(xiàn)貨,只做原裝進(jìn)口
詢(xún)價(jià)