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88W8987_SDS_V01中文資料恩智浦?jǐn)?shù)據(jù)手冊PDF規(guī)格書

88W8987_SDS_V01
廠商型號

88W8987_SDS_V01

功能描述

2.4/5 GHz Dual-band 1x1 Wi-Fi 5 (802.11ac) and Bluetooth 5.2 Solution

文件大小

1.08483 Mbytes

頁面數(shù)量

89

生產(chǎn)廠商 NXP Semiconductors
企業(yè)簡稱

nxp恩智浦

中文名稱

恩智浦半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-30 13:30:00

88W8987_SDS_V01規(guī)格書詳情

The 88W8987 is a highly integrated Wi-Fi (2.4/5 GHz) and Bluetooth single-chip solution,

specifically designed to support the speed, reliability, and quality requirements of next

generation Very High Throughput (VHT) products.

The System-on-Chip (SoC) provides both simultaneous and independent operation of the

following:

? IEEE 802.11ac (Wave 2), 1x1 with data rates up to MCS9 (433 Mbit/s)

? Bluetooth 5.2 (includes Bluetooth Low Energy (LE))

The SoC also provides:

? Bluetooth Classic and Bluetooth LE dual (Smart Ready) operation

? Wi-Fi indoor location positioning (802.11mc)

For security, the device supports high performance 802.11i security standards through

implementation of the Advanced Encryption Standard (AES)/Counter Mode CBCMAC

Protocol (CCMP), AES/Galois/Counter Mode Protocol (GCMP), AES/Cipher-

Based Message Authentication Code (CMAC), and WLAN Authentication and Privacy

Infrastructure (WAPI) security mechanisms.

For video, voice, and multimedia applications, 802.11e Quality of Service (QoS) is

supported. The device also supports 802.11h Dynamic Frequency Selection (DFS) for

detecting radar pulses when operating in the 5 GHz range.

Host interfaces include SDIO 3.0 and high-speed UART interfaces for connecting Wi-Fi

and Bluetooth technologies to the host processor.

The device is designed with two front-end configurations to accommodate Wi-Fi and

Bluetooth on either separate or shared paths:

? 2-antenna configuration—1x1 Wi-Fi and Bluetooth on separate paths (QFN)

? 1-antenna configuration—1x1 Wi-Fi and Bluetooth on shared paths (eWLP)

The following figures show the application diagrams for each package option.

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
TDK
2022+
SMD
6000
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品
詢價
NXP
23+
HVQFN
10000
原裝正品現(xiàn)貨
詢價
Marvell
23+
BGA
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢價
MARVELL
23+
BGA
50000
全新原裝正品現(xiàn)貨,支持訂貨
詢價
NXP Semiconductors
20+
QFN-68
29860
RF片上系統(tǒng)SOC-可開原型號增稅票
詢價
NXP
23+
TO-18
12800
原裝正品代理商最優(yōu)惠價格,現(xiàn)貨或訂貨
詢價
NXP
22+
HVQFN
25000
原裝現(xiàn)貨,價格優(yōu)惠,假一罰十
詢價
NXP
23+
WLCSP83
15462
原包裝原標(biāo)現(xiàn)貨,假一罰十,
詢價
21+
N/A
1392
全新原裝虧本出
詢價
NXP
22+23+
HVQFN
8000
新到現(xiàn)貨,只做原裝進口
詢價