935142050510-W0T中文資料村田數(shù)據(jù)手冊PDF規(guī)格書

? Compatible with MLCC footprint

? Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +150 °C)

o Voltage <-0.02/Volt

o Negligible capacitance loss through

ageing

? Low profile 0.1mm or 0.25mm

? Small size 0.80 x 0.80 mm (0303 format)

? Break down voltage : 100V

? Low leakage current

? High reliability

? High operating temperature (up to 150 °C)

? Compatible with high temperature cycling

during manufacturing operations (exceeding

300 °C)

? Compatible with EIA 00303 footprint

? Applicable for standard wire bonding assembly (ball and wedge)