98AON50417E中文資料安森美半導體數(shù)據(jù)手冊PDF規(guī)格書

This ultrafast rectifier in the dual flag SO?8 flat lead package offers

designers a unique degree of versatility and design freedom. The two

devices are electrically independent and can be used separately, as

common cathode, as common anode or in series as a function of board

level layout. The exposed pad design provides low thermal resistance.

The clip attach design creates a package with very efficient die size to

board area ratio. While thermal performance is nearly the same as the

DPAK package height and board footprint are less than half.

Features

? New Package Provides Capability of Inspection and Probe After

Board Mounting

? Low Forward Voltage Drop

? 175°C Operating Junction Temperature

? NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC?Q101

Qualified and PPAP Capable

? These are Pb?Free and Halide?Free Devices

Mechanical Characteristics:

? Case: Epoxy, Molded

? Epoxy Meets Flammability Rating UL 94?0 @ 0.125 in.

? Lead Finish: 100% Matte Sn (Tin)

? Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

? Device Meets MSL 1 Requirements

Applications

? Excellent Alternative to DPAK in Space?Constrained Automotive Applications

? Output Rectification in Switching Power Supplies

? Freewheeling Diode used with Inductive Loads