98ASB42669B中文資料安森美半導體數(shù)據(jù)手冊PDF規(guī)格書

Features

? Fine Lithography Trench?based Schottky Technology for Very Low

Forward Voltage and Low Leakage

? Fast Switching with Exceptional Temperature Stability

? Low Power Loss and Lower Operating Temperature

? Higher Efficiency for Achieving Regulatory Compliance

? High Surge Capability

? These are Pb?Free and Halide?Free Devices

Typical Applications

? Switching Power Supplies including Wireless, Smartphone and

Notebook Adapters

? High Frequency and DC?DC Converters

? Freewheeling and OR?ing diodes

? Reverse Battery Protection

? Instrumentation

? LED Lighting

Mechanical Characteristics:

? Case: Epoxy, Molded

? Epoxy Meets Flammability Rating UL 94?0 @ 0.125 in.

? Lead Finish: 100 Matte Sn (Tin)

? Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

? Device Meets MSL 1 Requirements