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A14557風(fēng)扇熱管理的熱-墊片規(guī)格書PDF中文資料

A14557
廠商型號(hào)

A14557

參數(shù)屬性

A14557 包裝為散裝;類別為風(fēng)扇熱管理的熱-墊片;產(chǎn)品描述:THERM PAD 457.2MMX457.2MM BLUE

功能描述

TflexTM 500 Series

文件大小

640.49 Kbytes

頁(yè)面數(shù)量

2 頁(yè)

生產(chǎn)廠商 Laird Tech Smart Technology
企業(yè)簡(jiǎn)稱

LSTD

中文名稱

Laird Tech Smart Technology官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-3-15 16:31:00

人工找貨

A14557價(jià)格和庫(kù)存,歡迎聯(lián)系客服免費(fèi)人工找貨

A14557規(guī)格書詳情

Compliant 2.8 W/mK Thermally Conductive Gap Filler

Tflex? 500 is a compliant elastomer gap filler designed to provide excellent thermal

performance while remaining cost effective. This soft interface pad conforms well with

minimal pressure, resulting in little or no stress on mating parts. Tflex? 500’s unique

silicone and filler combination has extremely low silicone extractables compared to many

other silicone interface products. Tflex? 500 meets NASA outgassing specification.

Tflex? 500 is naturally tacky, no adhesive coating is required. Tflex? 500 is electrically

insulating, stable from -50oC to 200oC and is certified to UL 94V0 flammability rating.

FEATURES AND BENEFITS

? Thermal conductivity 2.8 W/mK

? Highly compliant and cost effective

? Low thermal resistance even at low pressure

? Available in thicknesses from 0.020-inch (0.25mm) through

0.200-inch (5.0mm) in 0.010-inch increments

? Naturally tacky for easy assembly

? Low silicone extractables

APPLICATIONS

? Cooling components to chassis

? Telecommunication hardware

? Thermal module for notebook computer

? LED solid state lighting

? Power electronics

? Computer servers

? Graphics cards

? Gaming systems

? LCD and PDP flat panel displays

? Industrial automation equipment

? Wireless infrastructure

? Fragile ASIC components

? Automotive engine control

? IT devices

? Military electronics

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    A14557-02

  • 制造商:

    Laird Technologies - Thermal Materials

  • 類別:

    風(fēng)扇,熱管理 > 熱 - 墊,片

  • 系列:

    Tflex? 500

  • 包裝:

    散裝

  • 類型:

    填隙墊,片材

  • 形狀:

    方形

  • 外形:

    457.20mm x 457.20mm

  • 厚度:

    0.0300"(0.762mm)

  • 材料:

    硅樹脂人造橡膠

  • 粘合劑:

    膠粘 - 兩側(cè)

  • 底布,載體:

    玻璃纖維

  • 顏色:

    藍(lán)色

  • 導(dǎo)熱率:

    2.8W/m-K

  • 描述:

    THERM PAD 457.2MMX457.2MM BLUE

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫(kù)存 備注 價(jià)格
AVAGO/安華高
23+
DIP8
20000
原裝正品 歡迎咨詢
詢價(jià)
24+
sop-8
560
詢價(jià)
IC
1950+
980
只做原裝正品現(xiàn)貨!或訂貨假一賠十!
詢價(jià)
AVAGO
19+
DIPSOP8
60527
原廠代理渠道,每一顆芯片都可追溯原廠;
詢價(jià)
貨靚質(zhì)穩(wěn)
21+
SOP8
12588
一級(jí)代理品牌原裝正品
詢價(jià)
AVAGO
2020+
SOP8/DI
80000
只做自己庫(kù)存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價(jià)
AVAGO/安華高
22+
SMD
17800
原裝正品
詢價(jià)
AVAGO
2023+
SOP-8
62000
現(xiàn)貨特價(jià)
詢價(jià)
AVAGO/安華高
2023+
8700
原裝現(xiàn)貨
詢價(jià)
AGILENT
2447
SOP
100500
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨
詢價(jià)