A17690-13風(fēng)扇熱管理的熱-墊片規(guī)格書(shū)PDF中文資料

PRODUCT DESCRIPTION

Tflex? HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure

versus deflection characteristics. The combination will allow minimal stress on components

while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will

be experienced within your device.

Tflex? HD700PI can be provided with an integrated polyimide film on one side. This liner

provides numerous application benefits like electrical isolation, placement ease during

assembly, and tear resistance for applications that require shear.

Tflex? HD700 and Tflex? HD700PI are available in thickness from 0.5mm (0.020”) to 5mm

(0.200”). The standard material Tflex? HD700 material is a light pink color, but we do have the

option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR).

Laird can provide material to meet your production needs in any region through our local

production facilities. Please contact your local Laird sales or field engineering contact for

samples or questions.

FEATURES AND BENEFITS

? 5.0 W/mK thermal conductivity

? Low pressure versus deflection

? Excellent surface wetting for low contact resistance

? Minimizes board and component stress

? Option for additional electrical isolation and tear resistance

? Environmentally friendly solution that meets regulatory requirements including RoHS and

REACH