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A1SAP-GA中文資料恩楷楷數(shù)據(jù)手冊(cè)PDF規(guī)格書

A1SAP-GA
廠商型號(hào)

A1SAP-GA

功能描述

General Specifications

文件大小

245.69 Kbytes

頁(yè)面數(shù)量

7 頁(yè)

生產(chǎn)廠商 Nihon Kaiheiki Industry Co. Ltd.
企業(yè)簡(jiǎn)稱

NKK恩楷楷

中文名稱

恩楷楷(上海)開關(guān)有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-2-14 9:38:00

A1SAP-GA規(guī)格書詳情

Distinctive Characteristics

Subminiature size saves space on PC boards.

Specifically developed for logic-level applications.

Totally sealed body construction prevents contact contamination and allows time- and money-saving automated soldering and cleaning.

Award-winning STC contact mechanism with benefits unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement contents.)

Molded-in, epoxy sealed or ultrasonically welded terminals lock out flux, solvents, and other contaminants.

.100” x .100” (2.54mm x 2.54mm) terminal spacing conforms to standard PC board grid spacing.

Toggle option in antistatic material available for dissipating electrostatic discharges.

Matching indicators available and shown at the end of Section M.

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