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A3P600集成電路(IC)的FPGA(現(xiàn)場可編程門陣列)規(guī)格書PDF中文資料

A3P600
廠商型號

A3P600

參數(shù)屬性

A3P600 封裝/外殼為256-LBGA;包裝為托盤;類別為集成電路(IC)的FPGA(現(xiàn)場可編程門陣列);產(chǎn)品描述:IC FPGA 177 I/O 256FBGA

功能描述

ProASIC3 Flash Family FPGAs with Optional Soft ARM Support
IC FPGA 177 I/O 256FBGA

封裝外殼

256-LBGA

文件大小

9.57682 Mbytes

頁面數(shù)量

210

生產(chǎn)廠商 Microsemi Corporation
企業(yè)簡稱

Microsemi美高森美

中文名稱

美高森美公司官網(wǎng)

原廠標識
數(shù)據(jù)手冊

原廠下載下載地址一下載地址二到原廠下載

更新時間

2025-1-8 12:06:00

A3P600規(guī)格書詳情

A3P600屬于集成電路(IC)的FPGA(現(xiàn)場可編程門陣列)。由美高森美公司制造生產(chǎn)的A3P600FPGA(現(xiàn)場可編程門陣列)FPGA 是用于執(zhí)行邏輯運算和信息處理的用戶可配置集成電路產(chǎn)品,通常具有非常高級別的集成功能。這些器件通常用于代替通用微處理器,其中已知運算將以極高的速度執(zhí)行,例如用于接收和處理來自高速數(shù)據(jù)轉(zhuǎn)換器的信息。它們通常需要外部存儲設備來存儲用戶所需的配置,并在啟動時重新加載這些配置。

Features and Benefits

High Capacity

? 15 k to 1 M System Gates

? Up to 144 kbits of True Dual-Port SRAM

? Up to 300 User I/Os

Reprogrammable Flash Technology

? 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

? Instant On Level 0 Support

? Single-Chip Solution

? Retains Programmed Design when Powered Off

High Performance

? 350 MHz System Performance

? 3.3 V, 66 MHz 64-Bit PCI?

In-System Programming (ISP) and Security

? ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM?-enabled ProASIC?3 devices) via JTAG (IEEE 1532–compliant)?

? FlashLock? to Secure FPGA Contents

Low Power

? Core Voltage for Low Power

? Support for 1.5 V-Only Systems

? Low-Impedance Flash Switches

High-Performance Routing Hierarchy

? Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

? 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

? 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

? Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

? Bank-Selectable I/O Voltages—up to 4 Banks per Chip

? Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X? and LVCMOS 2.5 V / 5.0 V Input

? Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

? I/O Registers on Input, Output, and Enable Paths

? Hot-Swappable and Cold Sparing I/Os?

? Programmable Output Slew Rate? and Drive Strength

? Weak Pull-Up/-Down

? IEEE 1149.1 (JTAG) Boundary Scan Test

? Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL?

? Six CCC Blocks, One with an Integrated PLL

? Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

? Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory?

? 1 kbit of FlashROM User Nonvolatile Memory

? SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)?

? True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

? M1 ProASIC3 Devices—ARM?Cortex?-M1 Soft Processor Available with or without Debug

產(chǎn)品屬性

更多
  • 產(chǎn)品編號:

    A3P600L-1FG256

  • 制造商:

    Microsemi Corporation

  • 類別:

    集成電路(IC) > FPGA(現(xiàn)場可編程門陣列)

  • 系列:

    ProASIC3L

  • 包裝:

    托盤

  • 電壓 - 供電:

    1.14V ~ 1.575V

  • 安裝類型:

    表面貼裝型

  • 工作溫度:

    0°C ~ 85°C(TJ)

  • 封裝/外殼:

    256-LBGA

  • 供應商器件封裝:

    256-FPBGA(17x17)

  • 描述:

    IC FPGA 177 I/O 256FBGA

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