AGN20009Z中文資料松下電器數(shù)據(jù)手冊(cè)PDF規(guī)格書

FEATURES

? Compact slim body saves space

Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the pack aging density can be increased to allow for much smaller designs.

? Outstanding surge resistance.

Surge withstand between open contacts: 1,500 V 10×160 μs (FCC part 68)

Surge withstand between contacts and coil: 2,500 V 2×10 μs (Bellcore)

? The use of twin crossbar contacts ensures high contact reliability.

AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating vola tile gas from coil.

? Increased packaging density

Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging

density higher than ever before.

? Nominal operating power: 140 mW

? Outstanding vibration and shock resistance.

Functional shock resistance: 750 m/s2 {75G}

Destructive shock resistance: 1,000 m/s2 {100G}

Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)

Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)