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1 Features
Processor Cores:
? Up to Quad 64-bit Arm? Cortex?-A53
microprocessor subsystem at up to 1.4 GHz
– Quad-core Cortex-A53 cluster with 512KB L2
shared cache with SECDED ECC
– Each A53 Core has 32KB L1 DCache with
SECDED ECC and 32KB L1 ICache with Parity
protection
? Single-core Arm? Cortex?-M4F MCU at up to 400
MHz
– 256KB SRAM with SECDED ECC
? Dedicated Device/Power Manager
Multimedia:
? Display subsystem
– Dual display support
– 1920x1080 @ 60fps for each display
– 1x 2048x1080 + 1x 1280x720
– Up to 165 MHz pixel clock support with
Independent PLL for each display
– OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB
LVCMOS)
– Support safety feature such as freeze frame
detection and MISR data check
? 3D Graphics Processing Unit
– 1 pixel per clock or higher
– Fillrate greater than 500 Mpixels/sec
– >500 MTexels/s, >8 GFLOPs
– Supports at least 2 composition layers
– Supports up to 2048x1080 @60fps
– Supports ARGB32, RGB565 and YUV formats
– 2D graphics capable
– OpenGL ES 3.1, Vulkan 1.2
? One Camera Serial interface (CSI-Rx) - 4 Lane
with DPHY
– MIPI? CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
– Support for 1,2,3 or 4 data lane mode up to
1.5Gbps
– ECC verification/correction with CRC check +
ECC on RAM
– Virtual Channel support (up to 16)
– Ability to write stream data directly to DDR via
DMA
Memory Subsystem:
? Up to 816KB of On-chip RAM
– 64KB of On-chip RAM (OCSRAM) with
SECDED ECC , Can be divided into smaller
banks in increments of 32KB for as many as 2
separate memory banks
– 256KB of On-chip RAM with SECDED ECC in
SMS Subsystem
– 176KB of On-chip RAM with SECDED ECC in
SMS Subsystem for TI security firmware
– 256KB of On-chip RAM with SECDED ECC in
Cortex-M4F MCU subsystem
– 64KB of On-chip RAM with SECDED ECC in
Device/Power Manager Subsystem
? DDR Subsystem (DDRSS)
– Supports LPDDR4, DDR4 memory types
– 16-Bit data bus with inline ECC
– Supports speeds up to 1600 MT/s
– Max addressable range
? 8GBytes with DDR4
? 4GBytes with LPDDR4
Functional Safety:
? Functional Safety-Compliant targeted [Industrial]
– Developed for functional safety applications
– Documentation will be available to aid IEC
61508 functional safety system design
– Systematic capability up to SIL 3 targeted
– Hardware Integrity up to SIL 2 targeted
– Safety-related certification
? IEC 61508 by TUV SUD planned
? Functional Safety-Compliant targeted [Automotive]
– Developed for functional safety applications
– Documentation will be available to aid ISO
26262 functional safety system design
– Systematic capability up to ASIL D targeted
– Hardware integrity up to ASIL B targeted
– Safety-related certification
? ISO 26262 by TUV SUD planned
? AEC - Q100 qualified
Security:
? Secure boot supported
– Hardware-enforced Root-of-Trust (RoT)
– Support to switch RoT via backup key
– Support for takeover protection, IP protection,
and anti-roll back protection
? Trusted Execution Environment (TEE) supported
– Arm TrustZone? based TEE
– Extensive firewall support for isolation
– Secure watchdog/timer/IPC
– Secure storage support
– Replay Protected Memory Block (RPMB)
support
? Dedicated Security Controller with user
programmable HSM core and dedicated security
DMA & IPC subsystem for isolated processing
? Cryptographic acceleration supported
– Session-aware cryptographic engine with ability
to auto-switch key-material based on incoming
data stream
? Supports cryptographic cores
– AES – 128-/192-/256-Bit key sizes
– SHA2 – 224-/256-/384-/512-Bit key sizes
– DRBG with true random number generator
– PKA (Public Key Accelerator) to Assist in
RSA/ECC processing for secure boot
? Debugging security
– Secure software controlled debug access
– Security aware debugging
PRU Subsystem:
? Dual-core Programmable Real-Time Unit
Subystem (PRUSS) running up to 333 MHz
? Intended for driving GPIO for cycle accurate
protocols such as additional:
– General Purpose Input/Output (GPIO)
– UARTs
– I2C
– External ADC
? 16KByte program memory per PRU with SECDED
ECC
? 8KB data memory per PRU with SECDED ECC
? 32KB general purpose memory with SECDED
ECC
? CRC32/16 HW accelerator
? Scratch PAD memory with 3 banks of 30 x 32-bit
registers
? 1 Industrial 64-bit timer with 9 capture and
16 compare events, along with slow and fast
compensation
? 1 interrupt controller (INTC), minimum of 64 input
events supported
High-Speed Interfaces:
? Integrated Ethernet switch supporting (total 2
external ports)
– RMII(10/100) or RGMII (10/100/1000)
– IEEE1588 (Annex D, Annex E, Annex F with
802.1AS PTP)
– Clause 45 MDIO PHY management
– Packet Classifier based on ALE engine with
512 classifiers
– Priority based flow control
– Time sensitive networking (TSN) support
– Four CPU H/W interrupt Pacing
– IP/UDP/TCP checksum offload in hardware
? Two USB2.0 Ports
– Port configurable as USB host, USB peripheral,
or USB Dual-Role Device (DRD mode)
– Integrated USB VBUS detection
– Trace over USB supported
General Connectivity:
? 9x Universal Asynchronous Receiver-Transmitters
(UART)
? 5x Serial Peripheral Interface (SPI) controllers
? 6x Inter-Integrated Circuit (I2C) ports
? 3x Multichannel Audio Serial Ports (McASP)
– Transmit and Receive Clocks up to 50 MHz
– Up to 16/10/6 Serial Data Pins across 3x
McASP with Independent TX and RX Clocks
– Supports Time Division Multiplexing (TDM),
Inter-IC Sound (I2S), and Similar Formats
– Supports Digital Audio Interface Transmission
(SPDIF, IEC60958-1, and AES-3 Formats)
– FIFO Buffers for Transmit and Receive (256
Bytes)
– Support for audio reference output clock
? 3x enhanced PWM modules (ePWM)
? 3x enhanced Quadrature Encoder Pulse modules
(eQEP)
? 3x enhanced Capture modules (eCAP)
? General-Purpose I/O (GPIO), All LVCMOS I/O can
be configured as GPIO
? 3x Controller Area Network (CAN) modules with
CAN-FD support
– Conforms w/ CAN Protocol 2.0 A, B and ISO
11898-1
– Full CAN FD support (up to 64 data bytes)
– Parity/ECC check for Message RAM
– Speed up to 8Mbps
Media and Data Storage:
? 3x Multi-Media Card/Secure Digital? (MMC/SD?)
interface
– 1x 8-bit eMMC interface up to HS200 speed
– 2x 4-bit SD/SDIO interface up to UHS-I
– Compliant with eMMC 5.1, SD 3.0 and SDIO
Version 3.0
? 1× General-Purpose Memory Controller (GPMC)
up to 133 MHz
– Flexible 8- and 16-Bit Asynchronous Memory
Interface With up to four Chip (22-bit address)
Selects (NAND, NOR, Muxed-NOR, and
SRAM)
– Uses BCH Code to Support 4-, 8-, or 16-Bit
ECC
– Uses Hamming Code to Support 1-Bit ECC
– Error Locator Module (ELM)
? Used With the GPMC to Locate Addresses
of Data Errors From Syndrome Polynomials
Generated Using a BCH Algorithm
? Supports 4-, 8-, and 16-Bit Per 512-Byte
Block Error Location Based on BCH
Algorithms
? OSPI/QSPI with DDR / SDR support
– Support for Serial NAND and Serial NOR flash
devices
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Power Management:
? Low power modes supported by Device/Power
Manager
– Partial IO support for CAN/GPIO/UART wakeup
– DeepSleep
– MCU Only
– Standby
– Dynamic frequency scaling for Cortex-A53
Optimal Power Management Solution:
? Recommended TPS65219 Power Management
ICs (PMIC)
– Companion PMIC specially designed to meet
device power supply requirements
– Flexible mapping and factory programmed
configurations to support different use cases
Boot Options:
? UART
? I2C EEPROM
? OSPI/QSPI Flash
? GPMC NOR/NAND Flash
? Serial NAND Flash
? SD Card
? eMMC
? USB (host) boot from Mass Storage device
? USB (device) boot from external host (DFU mode)
? Ethernet
Technology / Package:
? 16-nm technology
? 13 mm x 13 mm, 0.5-mm pitch, 425-pin FCCSP
BGA (ALW)
? 17.2 mm x 17.2 mm, 0.8-mm pitch, 441-pin
FCBGA (AMC)
2 Applications
? Human Machine Interfaces (HMI)
? Retail automation
? Driver Monitoring System (DMS/OMS) / In-Cabin Monitoring (ICM)
? Telematics Control Unit (TCU)
? 3D Point Cloud
? Vehicle to Infrastructure / Vehicle to Vehicle (V2X / V2V)
? 3D Re-configurable automotive instrument cluster
? Appliance user interface and connectivity
? Medical equipment
3 Description
The low-cost AM62x Sitara? MPU family of application processors are built for Linux? application development.
With scalable Arm? Cortex?-A53 performance and embedded features, such as: dual-display support and 3D
graphics acceleration, along with an extensive set of peripherals that make the AM62x device well-suited for
a broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture as well.
Some of these applications include:
? Industrial HMI
? EV charging stations
? Touchless building access
? Driver monitoring systems
AM62x Sitara? processors are industrial-grade in the 13 x 13 mm package (ALW) and can meet the AEC -
Q100 automotive standard in the 17.2 x 17.2 mm package (AMC). Industrial and Automotive functional safety
requirements can be addressed using the integrated Cortex-M4F cores and dedicated peripherals, which can all
be isolated from the rest of the AM62x processor.
The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking
(TSN) support. An additional PRU module on the device enables real-time I/O capability for customer’s own
use cases. In addition, the extensive set of peripherals included in AM62x enables system-level connectivity,
such as: USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external
ASIC/FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security
Module (HSM) and employs advanced power management support for portable and power-sensitive applications
Products in the AM62x processor family:
? AM625 – Human-machine Interaction SoC with Arm? Cortex?-A53 based edge AI and full-HD dual-display
? AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
? AM623 – Internet of Thinks (IoT) and Gateway SoC with Arm? Cortex?-A53 based object and gesture
recognition
? AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X
systems
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
NS |
22+ |
SMD |
8200 |
全新原裝現(xiàn)貨!自家?guī)齑? |
詢價(jià) | ||
2322+ |
NA |
33220 |
無(wú)敵價(jià)格 主銷品牌 正規(guī)渠道訂貨 免費(fèi)送樣!!! |
詢價(jià) | |||
AMD |
23+ |
BGA |
7300 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價(jià) | ||
INTEL |
2021+ |
BGA |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
AMD |
23+ |
BGA |
7000 |
詢價(jià) | |||
RUBYCON/紅寶石 |
2023 |
NA |
4000 |
原廠代理渠道,正品保障 |
詢價(jià) | ||
AMTEK |
24+ |
SMD |
20000 |
一級(jí)代理原裝現(xiàn)貨假一罰十 |
詢價(jià) | ||
TI/德州儀器 |
23+ |
FCCSP-425 |
8355 |
只做原裝現(xiàn)貨/實(shí)單可談/支持含稅拆樣 |
詢價(jià) | ||
AMD |
BGA |
3752 |
只做原裝貨值得信賴 |
詢價(jià) | |||
HMC |
2023+ |
PLCC |
80000 |
一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品 |
詢價(jià) |