AT25FF081A集成電路（IC）的存儲器規(guī)格書PDF中文資料

Features

? Voltage Range: 1.65 V - 3.6 V

? 8 Mbit (4 x 2 Mbit physical block) Flash Memory

? Serial Peripheral Interface (SPI) compatible

? Supports SPI modes 0 and 3

? Supports dual output operation (1-1-2)

? Supports quad output operation (1-1-4)

? Supports quad I/O operation (1-4-4)

? Supports XiP operation (1-4-4, 0-4-4)

? 133 MHz maximum operating frequency

? Clock-to-output of 8 ns

? Flexible, optimized erase architecture for code + data

storage applications

? Uniform 4-kByte block erase

? Uniform 32-kByte block erase

? Uniform 64-kByte block erase

? Full chip erase

? Flexible non-volatile block protection

? 1 x 128-byte factory-programmed unique identifier

? 3 x 128-byte, One Time Programmable (OTP) security

registers

? Flexible programming

? Byte/Page program (1 to 256 Bytes)

? Sequential program mode capability

? Erase program suspend resume

? Software controlled Reset and Terminate commands

? Hardware reset option (via HOLD pin)

? JEDEC hardware reset

? Non-volatile Status Register configuration option

? JEDEC standard manufacturer and device ID read

methodology

? Serial Flash Discoverable Parameters (SFDP) version 1.6

? Low power dissipation

? 30 μA standby current (typical)

? 8.5 μA Deep Power-Down (DPD) current (typical)

? 7 nA Ultra Deep Power-Down (UDPD) current (typical)

? 8.5 mA active read current (1-1-1 — 104 MHz)

? 8.5 mA program current

? 9.6 mA erase current

? User configurable and auto I/O pin drive levels

? Endurance:100,000 program/erase cycles

? Data Retention: 20 years

? Temperature Range: -40 oC to +85 oC

? Industry standard green (Pb/Halide-free/RoHS Compliant)

Package Options

? 8-lead SOIC (150-mil)

? 8-lead SOIC (208-mil)

? 8-pad Ultra-thin DFN (2 x 3 x 0.6 mm)

? 8-ball WLCSP

? Die in Wafer Form (DWF)