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ATH10K1R25T70S中文資料ANALOGTECHNOLOGIES數(shù)據(jù)手冊(cè)PDF規(guī)格書

ATH10K1R25T70S
廠商型號(hào)

ATH10K1R25T70S

功能描述

Temperature Plate Assembly

文件大小

514.27 Kbytes

頁(yè)面數(shù)量

8 頁(yè)

生產(chǎn)廠商 Analog Technologies, Inc.
企業(yè)簡(jiǎn)稱

ANALOGTECHNOLOGIES

中文名稱

Analog Technologies, Inc.官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-1-9 10:30:00

ATH10K1R25T70S規(guī)格書詳情

MAIN FEATURES

Large platform for thermal load: 66mm × 44mm

Wide temperature regulation range: –20°C to 110°C

Accurate temperature stability: 1.8mV

Response to large set-point temperature change: 20s from

10 °C to 20°C

Response to small set-point temperature change: 6s from

20°C to 21°C

High thermal load capability: 15.75W

DESCRIPTION

ATTP1A is designed for evaluating TEC controllers,

which can be easily evaluated by using this temperature

plate.

ATTP1A aims to automatically adjust the temperature

parameters based on the requested temperature range so

that the TEC controller can detect the pre-set temperature

range.

Temperature plate ATTP1A works together with TEC

controller evaluation board and TEC controller. Figure 2

shows the physical photo of ATTP1A. The TEC evaluation

board connects with ATTP1A through CON1. On the right

side of ATTP1A, it connects with a TEC module, a

thermistor, a fan and a heat sink, see Figure 1. R1 (W11,

W12, R1A), R2 (W21, W22, R2A), R3 (W31, W32, R3A)

are TEC temperature control parameters, see Figure 2.

Required temperature parameters can be achieved through

adjusting R1, R2 and R3, thus the TEC controller can

detect the temperature range that users require.

In different temperature ranges, R1, R2 and R3 have

different corresponding resistances. R1, R2 and R3 can be

determined by:

Where RHIGH is the resistance of RTH in the highest

temperature of the set temperature range; RMID is the

resistance of RTH in the medium temperature of the set

temperature range; RLOW is the resistance of RTH in the

lowest temperature of the set temperature range. For

example, set the highest temperature 35°C and the lowest

temperature 15°C, so the medium value is 25°C.

In the R-T table, RHIGH, RMID and RLOW can be achieved,

see Table 2.

RHIGH = 6.5k; RMID = 10k; RLOW = 15.7k

In accordance with the above three formulas, R1, R2 and

R3 can be calculated:

R1=18.14k; R2=8.14k; R3=75.87k

As shown in Figure 4, R1 is equal to the sum of W11

(potentiometer), W12 (potentiometer) and R1A (fixed

value resistor), that is, R1=W11+W12+R1A. So simply

adjust W11 and W12, R1 will be 8.051k. W11 provides

coarse adjustment and W12 provides fine adjustment.

The same goes to R2 and R3, that is:

R2=W21+W22+R2A

R3=W32+W33+R3A

Where W21 and W31 provide coarse tuning; W22 and

W32 provide fine tuning.

At the bottom right side of the plate, there are three

switches S1, S2, and S3, which can be used to adjust the

temperature parameters. When adjusting R1, R2 and R3,

disconnect them with circuit (turn corresponding switch to

OUT), thus the measured R1, R2 and R3 are available.

When R1, R2 and R3 are all adjusted to the required

resistance, turn on all switches (switch to IN).

Solder pad TP11 and TP12 are test points of R1. When the

switch is off, use resistance function of the multimeter and

connect its two test leads to TP11 and TP12. At this time,

adjust W11 and W12, the resistance of R1 can be read in

the meter. Users can tune R1 on the basis of calculated

temperature parameters and get the required resistance

from the multimeter. This method is also applied to R2 and

R3. TP21 and TP22 can be used to test R2; TP31 and TP32

can be used to test R3.

There are solder joints on the sides of the board. These

solder joints can be used to connect with external devices

or components. Test lines of other devices can be placed

into the holes of solder pads directly.

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