ATLS250MA103中文資料ANALOGTECHNOLOGIES數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

Ultra Low Noise: 2.5μAP-P @0.1Hz to 10Hz

High Current without Heat Sink: 250mA

High Absolute Accuracy: <0.1

High Stability: <100ppm/°C

Programmable Current Limit

Complete Shielding

Compact Size

100 Lead (Pb)-free and RoHS Compliant

DIP and SMT Packages Available

DESCRIPTION

The ATLS250MA103 is an electronic module designed for

driving diode lasers with up to 250mA low noise current.

Figure 1 shows physical photo of ATLS250MA103.The

output voltage is 0.4V to VVPS ? 1V when powered by a 5V

power supply.

When the maximum power consumed by the controller is

maintained to <1W, it does not require a heat sink to operate.

The controller has temperature compensation network so

that the output current maintains the same even as the

controller temperature rises.

In case the controller temperature exceeds a preset limit, 120°C,

the controller will be shut down by itself to prevent the

controller from being damaged by the over heat.

The output current of the ATLS250MA103 can be set by an

input voltage linearly or modulated by an external large signal

of up to 1MHz in bandwidth, resulting in a minimum 170nS

rise and fall times (Large signal) at the output current.

A highly stable low noise 2.5V reference voltage is provided

internally for setting the output current. This reference can also

be used as the voltage reference for external ADCs (Analog to

Digital Converters) and/or DACs (Digital to Analog

Converters) which are utilized for converting the analog signals,

such as LIO which represents the output current, into digital

signals, and/or converting the digital signals into analog ones

for setting the analog voltages, such as LIS which sets the

output current.

The ATLS250MA103 is packaged in a 6 sided metal enclosure,

which blocks EMIs (Electro-Magnetic Interferences) to prevent

the controller and other electronics from interfering each other.

This laser driver can be evaluated by our evaluation board,

ATLS1A103DEV1.0.

There are 2 packaging versions available: DIP through hole

package and surface mount type.