首頁(yè) >ATMEGA1608-XUR>規(guī)格書列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
ChipvaristorsESD/Voltageprotectiondevices | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
ChipvaristorsESD/Voltageprotectiondevices | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
Low-LossFilter Features ■LowlossRFfilterforDAB ■Usablepassband40MHz ■Unbalancedorbalancedoperation ■Nomatchingnetworkrequiredforoperationat50? ■CeramicpackageforSurfaceMountedTechnology(SMT) Terminals ■Ni,gold-plated | EPCOSepcos 愛(ài)普科斯 | EPCOS | ||
SAWRFlowlossfilter | EPCOSepcos 愛(ài)普科斯 | EPCOS | ||
MultilayerChipBaluns Features MonolithicSMDwithsmall,low-profileandlight-weighttype. Applications 0.8~6GHzwirelesscommunicationsystems,includingDECT/PACS/PHS/GSM/DCSphones,WLANcard,Bluetoothmodules,Hyper-LAN,etc. | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
WIRE-WOUNDCHIPPOWERINDUCTORS(BRSERIES) | TAIYO-YUDENTaiyo Yuden (U.S.A.), Inc 太陽(yáng)誘電太陽(yáng)誘電株式會(huì)社 | TAIYO-YUDEN | ||
WIRE-WOUNDCHIPPOWERINDUCTORS(BRSERIES) | TAIYO-YUDENTaiyo Yuden (U.S.A.), Inc 太陽(yáng)誘電太陽(yáng)誘電株式會(huì)社 | TAIYO-YUDEN | ||
ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,16AWG,0.55L,TinPlated,Black. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,16AWG,0.55L,TinPlated,Black,ForuseonCuCond. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,16AWG,0.55L,TinPlated,Red,ForuseonCuCond. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
CuAlloyBareFerrule,SmoothFunnelEntry,16AWG,0.32L,Seamlessbbl,TinPlated,ForUseOnCuCond. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
CAPACITORS | etc2List of Unclassifed Manufacturers etc未分類制造商etc2未分類制造商 | etc2 | ||
MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MultilayerCeramicChipCapacitorsGeneraluse Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MultilayerCeramicChipCapacitorsGeneraluse Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MultilayerCeramicChipCapacitors | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
Microchip Technology |
24+ |
28-SSOP(0.209,5.30mm 寬) |
25000 |
微控制器MCU單片機(jī)-原裝正品 |
詢價(jià) | ||
Microchip |
21+ |
SSOP |
15000 |
只做原裝 |
詢價(jià) | ||
Microchip |
22+ |
28-SSOP |
9000 |
原廠渠道,現(xiàn)貨配單 |
詢價(jià) | ||
Microchip Technology |
24+ |
28-SSOP |
5000 |
全新原裝現(xiàn)貨庫(kù)存 |
詢價(jià) | ||
microchip |
23+ |
SSOP |
15423 |
原包裝原標(biāo)現(xiàn)貨,假一罰十, |
詢價(jià) | ||
Microchip/微芯 |
23+ |
SSOP |
2100 |
全新原裝正品 現(xiàn)貨可訂 |
詢價(jià) | ||
MICROCHIP/微芯 |
24+ |
SMT |
18000 |
誠(chéng)以養(yǎng)德,用芯做事,全新原裝原盒原標(biāo)出貨。 |
詢價(jià) | ||
Microchip |
QQ咨詢 |
28-SSOP |
3000 |
原裝正品/微控制器元件授權(quán)代理直銷! |
詢價(jià) | ||
Microchip Technology |
24+ |
28-SSOP(0.209 5.30mm 寬) |
9350 |
獨(dú)立分銷商 公司只做原裝 誠(chéng)心經(jīng)營(yíng) 免費(fèi)試樣正品保證 |
詢價(jià) | ||
MICROCHIP(美國(guó)微芯) |
2112+ |
TQFP-48(7x7) |
31500 |
250個(gè)/托盤一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng) |
詢價(jià) |
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