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T1250-600G

12ASnubberless?,logiclevelandstandardTriacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mountpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramic

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600G

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600G-TR

12ASnubberless?,logiclevelandstandardTriacs

Features ?MediumcurrentTriac ?Lowthermalresistancewithclipbonding ?LowthermalresistanceinsulationceramicforinsulatedBTA ?Highcommutation(4Q)orveryhighcommutation(3Q)capability ?BTAseriesUL1557certified(fileref:81734) ?PackagesareRoHS(2011/65/EU)compliant

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600G-TR

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600R

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

T1250-600R-TR

12ASnubberless??logiclevelandstandardtriacs

Description Availableeitherinthrough-holeorsurface-mounpackages,theBTA12,BTB12andT12xxtriacseriesissuitableforgeneralpurposemainspowerACswitching. Features ■Mediumcurrenttriac ■Lowthermalresistancewithclipbonding ■Lowthermalresistanceinsulationceramicfori

STMICROELECTRONICSSTMicroelectronics

意法半導(dǎo)體意法半導(dǎo)體集團(tuán)

供應(yīng)商型號品牌批號封裝庫存備注價格
RMI
16+
BGA
2500
進(jìn)口原裝現(xiàn)貨/價格優(yōu)勢!
 詢價
AMD
BGAQFP
6688
15
現(xiàn)貨庫存
 詢價
RMI
24+
BGA
6500
獨立分銷商 公司只做原裝 誠心經(jīng)營 免費試樣正品保證
 詢價
AMD
24+
BGA
6980
原裝現(xiàn)貨,可開13%稅票
 詢價
RMI
2016+
BGA
6528
只做進(jìn)口原裝現(xiàn)貨!或者訂貨,假一賠十!
 詢價
BROADCOM
.
1680
正品原裝--自家現(xiàn)貨-實單可談
 詢價
RMI
19+
BGA
65109
原廠代理渠道,每一顆芯片都可追溯原廠；
 詢價
AMD
14+
1218
全新進(jìn)口原裝
 詢價
RMI
23+
BGA
20000
原廠原裝正品現(xiàn)貨
 詢價
RMI
2020+
BGA
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
 詢價
更多AU1250-600MGF供應(yīng)商 更新時間2025-1-20 15:14:00

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