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HSMX-H670

SurfaceMountFlipChipLEDs

Description TheHSMX-H670andHSMX-H690introducearevolutionaryconcepttotheworldofLEDs.Theinternalflipchipconstructioneliminatesthewirebondbetweenthechipandprintedcircuitboard.Consequentlyasaresultoftherobustconstruction,productreliabilityisgreatlyimproved. T

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HSMX-S670

HighPerformanceSurfaceMountChipLEDs

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HSMY-C670

SurfaceMountChipLEDs

Description ThesesingleandbicolorLEDsaredesignedinanindustrystandardpackageforeaseofhandlinganduse.FivedifferentLEDcolorsareavailableintwocompact,lowprofile,singlecolorpackages. Features ?SmallSize ?IndustryStandardFootprint ?LowProfile ?T

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HSMY-H670

SurfaceMountFlipChipLEDs

Description TheHSMX-H670andHSMX-H690introducearevolutionaryconcepttotheworldofLEDs.Theinternalflipchipconstructioneliminatesthewirebondbetweenthechipandprintedcircuitboard.Consequentlyasaresultoftherobustconstruction,productreliabilityisgreatlyimproved. T

HPAgilent(Hewlett-Packard)

安捷倫科技安捷倫科技有限公司

HTAPE-POWER670-VM

Tasmysamospajalne-winylowe,mastyksowe

W?asciwosci ??atwewuzyciuwinylowetasmymastyksowe ?Samoprzylepne-bezrozciagania ?Warstwamastycznabardzolepka,zapewniadoskona?aochrone przedwilgocia ?Winylowawarstwawierzchniazapewniadodatkowaochrone ?Nietracaw?asciwosciwniskichtemperaturach ?G?ównaizolacjaele

HellermannTytonHellermann Tyton

赫勒曼泰騰

KRC670E

EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT)

SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION FEATURES ?WithBuilt-inBiasResistors. ?SimplifyCircuitDesign. ?ReduceaQuantityofPartsandManufacturingProcess.

KECKEC CORPORATION

KEC株式會社

KRC670U

EPITAXIALPLANARNPNTRANSISTOR(SWITCHING,INTERFACECIRCUITANDDRIVERCIRCUIT)

SWITCHINGAPPLICATION. INTERFACECIRCUITANDDRIVERCIRCUITAPPLICATION FEATURES ●WithBuilt-inBiasResistors. ●SimplifyCircuitDesign. ●ReduceaQuantityofPartsandManufacturingProcess.

KECKEC CORPORATION

KEC株式會社

L-670

CommonModeInductorForDC/DCPowersupply

RHOMBUS-IND

Rhombus Industries Inc.

LB670Z

GREENOVALLAMPLED

GREENOVALLAMPLED

SEOULSeoul Semiconductor Co., Ltd.

首爾半導體首爾半導體有限公司

LC670Z

GREENOVALLAMPLED

GREENOVALLAMPLED

SEOULSeoul Semiconductor Co., Ltd.

首爾半導體首爾半導體有限公司

詳細參數(shù)

  • 型號：

    B-670

  • 制造商：

    Hozan Tool Industrial Co Ltd

供應商型號品牌批號封裝庫存備注價格
OKWEnclosures
新
5
全新原裝 貨期兩周
 詢價
OKW Enclosures
2022+
1
全新原裝 貨期兩周
 詢價
CRYDOM
24+
5000
全新原裝
 詢價
CRYDOM
23+
MODULE
5000
原廠授權代理,海外優(yōu)勢訂貨渠道?？商峁┐罅繋齑?詳
 詢價
AMPHENOL
23+
220
詢價
Amphenol RF
2021+
母座
285000
專供連接器,軍工合格供應商!
 詢價
Amphenol
2022+
原廠原包裝
6800
全新原裝 支持表配單 中國著名電子元器件獨立分銷
 詢價
AMPHENOL
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現(xiàn)貨
 詢價
AMPHENOL
23+
原廠正規(guī)渠道
5000
專注配單,只做原裝進口現(xiàn)貨
 詢價
AMPHENOL/安費諾
24+
37325
原廠現(xiàn)貨渠道
 詢價
更多B-670供應商 更新時間2025-5-5 16:06:00

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