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BB830中文資料BUSBOARD數(shù)據(jù)手冊PDF規(guī)格書

BB830
廠商型號

BB830

功能描述

830 tie-point Solderless Plug-In BreadBoard with power rails

文件大小

812.6 Kbytes

頁面數(shù)量

2

生產(chǎn)廠商 BusBoard Prototype Systems Ltd.
企業(yè)簡稱

BUSBOARD

中文名稱

BusBoard Prototype Systems Ltd.官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二

更新時間

2024-12-22 23:00:00

BB830規(guī)格書詳情

Features:

? 830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips

providing 4 power rails.

? ABS plastic body with black printed legend. Color legend on distribution strips.

? Contacts are Phosphor Bronze with Plated Nickel Finish, rated for 50,000 insertions.

? Rated at 36 Volts, 2 Amps.

? Insertion Wire Size is 21 to 26 AWG, 0.016 to 0.028 inches diameter (0.4 to 0.7mm diameter).

? Peelable adhesive tape backing provided for attaching to a surface. Metal back plate provided.

產(chǎn)品屬性

  • 型號:

    BB830

  • 功能描述:

    印刷電路板和試驗板 830 TIE POINT PLUG IN BRDBOARD

  • RoHS:

  • 制造商:

    3M Electronic Solutions Division

  • 產(chǎn)品:

    Jumper & Insulated Wires

  • 描述/功能:

    Jumper wire, 22 AWG 0.1 inch

  • 長度:

    0.1 in

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
INFINEON/英飛凌
23+
NA/
66000
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2016+
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3500
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PHILIPS
23+
SOD323
12300
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Sod-323
28637
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INFINEON
SOD-323
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PHILIPS
22+
sod323
8000
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INFINEON
24+
SOD-3230805
351400
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INFINEON
22+
SOD323
18393
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Infineon(英飛凌)
23+
標(biāo)準(zhǔn)封裝
7000
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詢價
INFINEON
24+
SOD-323
5000
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詢價