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CAK-001MF

TDKDCtoDCConverters,DCtoACinverters

TDKTDK Corporation

TDK株式會(huì)社東電化（中國(guó)）投資有限公司

CA-TS-001

SENSORCABLEASSY,3.96mm3POSCONN,TORTDPT1000,TEMPERATURESENSOR

ADAM-TECHAdam Technologies, Inc.

亞當(dāng)科技亞當(dāng)科技股份有限公司

CC.001

SMTC-ClipConnectorwith1mmWorkingHeight

TAOGLAS

Taoglas antenna solutions

CC001

Cloud-connected8-channelthermocoupledatalogger

PICO

Pico Technology Ltd.

CCMR001

CLASSCC/CDCCMRSERIESFUSES

Description TheCCMRseriesisidealforspacesavingprotection ofmotorsupto40hp*.Itwasdesignedspecificallyto withstandsustainedstartingcurrentsofsmallmotors.The CCMR60fuseisthesmallest60Afuseavailableratedat 600V.ComparedtootherULListedfuses,ClassCCfuse

Littelfuselittelfuse

力特力特公司

CDBF001A

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBFR001A

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBN001A

SMDSchottkyBarrierDiode

Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method2026 Polarity:Indicated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBS001A

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method20

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBU001A

SMDSchottkyBarrierDiode

Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method

COMCHIPComchip Technology

典琦典琦科技股份有限公司

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和泉
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163
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SIE
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5
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BELLNIX
22+23+
New
35377
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