BUK7S1R0-40H中文資料安世數(shù)據(jù)手冊PDF規(guī)格書

1. General description

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction

technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and

qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.

2. Features and benefits

? Fully automotive qualified to beyond AEC-Q101:

? -55 °C to +175 °C rating suitable for thermally demanding environments

? LFPAK88 package:

? Designed for smaller footprint and improved power density over older wire bond packages

such as D2PAK for today’s space constrained high power automotive applications

? Thin package and copper clip enables LFPAK88 to be highly efficient thermally

? LFPAK copper clip technology enabling improvements over wire bond packages by:

? Increased maximum current capability and excellent current spreading

? Improved RDSon

? Low source inductance

? Low thermal resistance Rth

? LFPAK Gull Wing leads:

? Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal

cycling stress, unlike traditional QFN packages

? Visual (AOI) soldering inspection, no need for expensive x-ray equipment

? Easy solder wetting for good mechanical solder joint

? Unique 40 V Trench 9 superjunction technology:

? Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint

? Improved SOA and avalanche capability compared to standard TrenchMOS

? Tight VGS(th) limits enable easy paralleling of MOSFETs

3. Applications

? 12 V automotive systems

? 48 V DC/DC systems (on 12 V secondary side)

? Higher power motors, lamps and solenoid control

? Reverse polarity protection

? LED lighting

? Ultra high performance power switching