首頁(yè) >BURNDY_YF0130ID>規(guī)格書(shū)列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
BURNDY_YF0130ID | Elect Cu Single Insul Wire Ferrules, Smooth Funnel Entry, 1 AWG, 1.81 L, Tin Plated, Blue, For use on Cu Cond. | HUBBELL HUBBELL INCORPORATED | HUBBELL | |
ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,1AWG,1.81L,TinPlated,OliveGreen,ForuseonCuCond. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,1AWG,1.81L,TinPlated,OliveGreen. | HUBBELL HUBBELL INCORPORATED | HUBBELL | ||
rohscompliant | TAOGLAS Taoglas antenna solutions | TAOGLAS | ||
TaoglasCableAssemblySMA(F)BulkheadStraighttoMCX(M)PlugStraightwith75mmRG-174cable | etc2List of Unclassifed Manufacturers etc未分類制造商etc2未分類制造商 | etc2 | ||
TaoglasCableAssemblySMA(F)BulkheadStraighttoMCX(M)PlugStraightwith75mmRG-174cable | TAOGLAS Taoglas antenna solutions | TAOGLAS | ||
CURRENTLIMITINGDIODE DESCRIPTION TheCENTRALSEMICONDUCTORCCL0035Seriestypesaresiliconfieldeffectcurrentregulatordiodesdesignedforapplicationsrequiringaconstantcurrentoverawidevoltagerange.ThesedevicesaremanufacturedinthecosteffectiveDO-35doubleplugcase,whichprovidesmanybenefits | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
CURRENTLIMITINGDIODE CURRENTLIMITINGDIODE AvailableNon-RoHS(standard)orRoHScompliant(addPBFsuffix). Availableas“HR”(highreliability)screenedperMIL-PRF-19500,JANTXlevel.Add“HR”suffixtobasepartnumber. | DIGITRON Digitron Semiconductors | DIGITRON | ||
SURFACEMOUNTSILICONCURRENTLIMITINGDIODE | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
CURRENTLIMITINGDIODE DESCRIPTION: TheCENTRALSEMICONDUCTORCCLM0035seriestypesaresiliconfieldeffectcurrentregulatordiodesdesignedforapplicationsrequiringaconstantcurrentoverawidevoltagerange.ThesedevicesaremanufacturedinthecosteffectiveSOD-80doubleplugcasewhichprovidesmanybenefit | CentralCentral Semiconductor Corp 美國(guó)中央半導(dǎo)體 | Central | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. P | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,so | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mark | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=30Volts Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
N/A |
2021+ |
SMD |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
2000 |
50 |
詢價(jià) | |||||
50 |
2023+ |
全新原裝庫(kù)存現(xiàn)貨部分訂貨 |
80000 |
一級(jí)代理/分銷(xiāo)渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品 |
詢價(jià) | ||
TI/德州儀器 |
23+ |
HTSSOP48 |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價(jià) | ||
TI/德州儀器 |
23+ |
HTSSOP48 |
10880 |
原裝正品,支持實(shí)單 |
詢價(jià) | ||
TI(德州儀器) |
23+ |
NA/ |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!! |
詢價(jià) | ||
TI/德州儀器 |
23+ |
NA/ |
133 |
優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開(kāi)增值稅票 |
詢價(jià) | ||
50 |
23+ |
原廠正規(guī)渠道 |
5000 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價(jià) | ||
50 |
23+ |
原廠正規(guī)渠道 |
5000 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價(jià) | ||
國(guó)產(chǎn) |
22+ |
ZIP15 |
69000 |
鄭重承諾只做原裝進(jìn)口貨 |
詢價(jià) |
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