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首頁 >BURNDY_YF2012ID>規(guī)格書列表

零件編號(hào)	下載&訂購	功能描述	制造商&上傳企業(yè)	LOGO
BURNDY_YF2012ID	文件：271.87 Kbytes Page：2 Pages	Elect Cu Single Insul Wire Ferrules, Smooth Funnel Entry, 20 AWG, 0.71 L, Tin Plated, Gray, For use on Cu Cond.	HUBBELL HUBBELL INCORPORATED	HUBBELL
BURNDY_YF2012IT	文件：271.91 Kbytes Page：2 Pages	ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,Blue,ForuseonCuCond.	HUBBELL HUBBELL INCORPORATED	HUBBELL
BURNDY_YF2012IW	文件：254.57 Kbytes Page：2 Pages	ElectCuSingleInsulWireFerrules,SmoothFunnelEntry,20AWG,0.71L,TinPlated,White,ForuseonCuCond.	HUBBELL HUBBELL INCORPORATED	HUBBELL
BURNDY_YF2012UI	文件：259.11 Kbytes Page：2 Pages	CuAlloyBareFerrule,SmoothFunnelEntry,20AWG,0.47L,Seamlessbbl,TinPlated,ForUseOnCuCond.	HUBBELL HUBBELL INCORPORATED	HUBBELL
C2012	文件：448.8 Kbytes Page：7 Pages	CAPACITORS	etc2List of Unclassifed Manufacturers etc未分類制造商etc2未分類制造商	etc2
C2012	文件：2.57112 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：1.13758 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：1.3923 Mbytes Page：72 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57186 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57112 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：173.01 Kbytes Page：31 Pages	MultilayerCeramicChipCapacitorsGeneraluse Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57112 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthand reliability. ?LowESLandexcellentfrequency	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：173.01 Kbytes Page：31 Pages	MultilayerCeramicChipCapacitorsGeneraluse Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：173.01 Kbytes Page：31 Pages	MultilayerCeramicChipCapacitors	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57364 Mbytes Page：1 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57364 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：357.4 Kbytes Page：1 Pages	HEYCo-moldedLiquidTightBreak-ThruPlugs	etc2List of Unclassifed Manufacturers etc未分類制造商etc2未分類制造商	etc2
C2012	文件：1.86627 Mbytes Page：31 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：1.66928 Mbytes Page：12 Pages	MULTILAYERCERAMICCHIPCAPACITORS Features ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?LowESLandexcellentfrequencycharacteristicsallowforacircuitde	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK
C2012	文件：2.57112 Mbytes Page：55 Pages	MULTILAYERCERAMICCHIPCAPACITORS	TDKTDK Corporation TDK株式會(huì)社東電化（中國）投資有限公司	TDK

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供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫存	備注	價(jià)格
艾睿國際（香港）有限公司	BURNDYCORP-QILE-52P-410T	N/A	2021+	SMD	100500	一級(jí)代理專營品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長期排單到貨	詢價(jià)
深圳市龍騰翼電子科技有限公司	BUROPA27GU		2000		50		詢價(jià)
深圳市維爾達(dá)電子有限公司	BURR-BROWN	50	2023+	全新原裝庫存現(xiàn)貨部分訂貨	80000	一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品	詢價(jià)
深圳市威爾健半導(dǎo)體有限公司	BURR-BROWN	TI/德州儀器	23+	HTSSOP48	50000	全新原裝正品現(xiàn)貨,支持訂貨	詢價(jià)
易創(chuàng)佳業(yè)科技（深圳）有限公司	BURR-BROWN	TI/德州儀器	23+	HTSSOP48	10880	原裝正品，支持實(shí)單	詢價(jià)
深圳市高捷芯城科技有限公司	BURR-BROWN	TI(德州儀器)	23+	NA/	7350	現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!!	詢價(jià)
深圳市得捷芯城科技有限公司	BURR-BROWN	TI/德州儀器	23+	NA/	133	優(yōu)勢(shì)代理渠道,原裝正品,可全系列訂貨開增值稅票	詢價(jià)
深圳市創(chuàng)新跡電子有限公司	BURR-BROWN	50	23+	原廠正規(guī)渠道	5000	專注配單,只做原裝進(jìn)口現(xiàn)貨	詢價(jià)
深圳市安富世紀(jì)電子有限公司	BURR-BROWN	50	23+	原廠正規(guī)渠道	5000	專注配單,只做原裝進(jìn)口現(xiàn)貨	詢價(jià)
深圳市東來寶電子科技有限公司	BUS0001	國產(chǎn)	22+	ZIP15	69000	鄭重承諾只做原裝進(jìn)口貨	詢價(jià)

更多BURNDY_YF2012ID供應(yīng)商更新時(shí)間2024-12-25 15:00:00

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