BYG70G中文資料飛利浦數(shù)據(jù)手冊PDF規(guī)格書
BYG70G規(guī)格書詳情
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
? Glass passivated
? High maximum operating temperature
? Low leakage current
? Excellent stability
? Guaranteed avalanche energy absorption capability
? UL 94V-O classified plastic package
? Shipped in 12 mm embossed tape.
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
PHILIPS |
24+ |
DO-214AC |
18560 |
假一賠十全新原裝現(xiàn)貨特價供應(yīng)工廠客戶可放款 |
詢價 | ||
PHI |
21+ |
99+ |
12588 |
原裝正品,自己庫存 假一罰十 |
詢價 | ||
VISHAY |
DO-214AC |
68900 |
原包原標簽100%進口原裝常備現(xiàn)貨! |
詢價 | |||
PHILIPS/飛利浦 |
2019+PB |
SOD106 |
15000 |
原裝正品 可含稅交易 |
詢價 | ||
PHILIPS/飛利浦 |
22+ |
SOD106 |
50000 |
原裝正品 |
詢價 | ||
ADI |
2020+ |
SOJ |
80000 |
只做自己庫存,全新原裝進口正品假一賠百,可開13%增 |
詢價 | ||
PHILIPS |
23+ |
原廠正規(guī)渠道 |
5000 |
專注配單,只做原裝進口現(xiàn)貨 |
詢價 | ||
NXP/恩智浦 |
23+ |
SMADO-214AC |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
NXP恩智浦/PHILIPS飛利浦 |
24+ |
DO-214SMA |
6200 |
新進庫存/原裝 |
詢價 | ||
PHILIPS/飛利浦 |
22+ |
SOD106 |
354000 |
詢價 |
