BYV1100中文資料飛利浦數(shù)據(jù)手冊PDF規(guī)格書
BYV1100規(guī)格書詳情
DESCRIPTION
Cavity free cylindrical glass package through Implotec?(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
? Glass passivated
? High maximum operating temperature
? Low leakage current
? Excellent stability
? Available in ammo-pack.
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
PH |
23+ |
TO-220 |
27617 |
##公司主營品牌長期供應(yīng)100%原裝現(xiàn)貨可含稅提供技術(shù) |
詢價 | ||
PH |
2023+ |
SOD-81 |
5800 |
進口原裝,現(xiàn)貨熱賣 |
詢價 | ||
NXP/恩智浦 |
24+ |
65230 |
詢價 | ||||
1415+ |
TO-263 |
28500 |
全新原裝正品,優(yōu)勢熱賣 |
詢價 | |||
PHILIPS/飛利浦 |
23+ |
TO-220 |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
PH原裝 |
20+ |
TO-220 |
1022 |
進口原裝現(xiàn)貨,假一賠十 |
詢價 | ||
PHILIPS/飛利浦 |
23+ |
TO-220 |
7000 |
詢價 | |||
PHILIPS |
22+ |
TO-220 |
8000 |
原裝正品支持實單 |
詢價 | ||
PHILIPS |
17+ |
TO-220 |
6200 |
詢價 | |||
NXP/恩智浦 |
22+ |
TO-263 |
92537 |
詢價 |