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首頁 >CBBR0140>規(guī)格書列表

零件編號(hào)	下載&訂購	功能描述	制造商&上傳企業(yè)	LOGO
CDBER0140L	文件：193.26 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140L-HF	文件：193.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140R	文件：126.37 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderablep	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0140R-HF	文件：195.43 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140L	文件：151.03 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140L-HF	文件：195.14 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA RoHSDevice HalogenFree VR=40Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,Moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140R	文件：150.83 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0140R-HF	文件：195.26 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140L	文件：72.66 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, Moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140L-HF	文件：123.39 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, Moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140R	文件：72.7 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0140R-HF	文件：123.55 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBK0140L	文件：195.12 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Terminals:Goldplated,solderableperMIL-STD-750,method2026. Case:SOD-123Fstandardpackage	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBK0140R	文件：195.27 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-123Fstandardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0140L-HF	文件：476.33 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0140R-HF	文件：103 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L	文件：193.71 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L	文件：123.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L-HF	文件：123.08 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0140L-HF	文件：193.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=40Volts RoHSDevice Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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詳細(xì)參數(shù)

型號(hào)：
CBBR0140
制造商：
Farnell/Pro-Power
功能描述：
CABLE MAINS 0.75MM 3 CORE 100M

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫存	備注	價(jià)格
深圳市振宏微科技有限公司	CBBR0202	PRO-POWER	23+	NA	136	專做原裝正品,假一罰百!	詢價(jià)
深圳市一線半導(dǎo)體有限公司	CB-BTIODK311I-01	ConnectBlue	24+		11		詢價(jià)
深圳市澳億芯電子科技有限公司	CBBV	CATALYST	07+	MSOP-8	574	普通	詢價(jià)
深圳市維爾達(dá)電子有限公司	CBB電容0.33UF/400V	CBB	2023+	10MM	80000	一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品	詢價(jià)
貿(mào)澤芯城（深圳）電子科技有限公司	CBC:MARKING	MAKOSEMI	23+	SOT-89	800004020	原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種	詢價(jià)
深圳市華睿芯科技有限公司	CBC012102N0054B	FUJ	23+	QFP	20000	原廠原裝正品現(xiàn)貨	詢價(jià)
深圳市創(chuàng)新跡電子有限公司	CBC012102N0054B	FUJ	23+	QFP	5000	專注配單,只做原裝進(jìn)口現(xiàn)貨	詢價(jià)
深圳市安富世紀(jì)電子有限公司	CBC012102N0054B	FUJ	23+	QFP	5000	專注配單,只做原裝進(jìn)口現(xiàn)貨	詢價(jià)
深圳市吉銀科技有限公司	CBC012-D5C	CYM	1535+		148		詢價(jià)
深圳市熠燦電子科技有限公司	CBC012-D5C	CYM	23+		148	全新原裝，歡迎來電咨詢	詢價(jià)

更多CBBR0140供應(yīng)商更新時(shí)間2024-12-27 17:00:00

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