CC2640R2FRF/IF射頻/中頻RFID的射頻收發(fā)器IC規(guī)格書PDF中文資料

CC2640R2F屬于RF/IF射頻/中頻RFID的射頻收發(fā)器IC。由德州儀器制造生產(chǎn)的CC2640R2F射頻收發(fā)器 IC射頻收發(fā)器 IC 是將發(fā)射器和接收器集成于單個(gè)封裝的半導(dǎo)體器件。收發(fā)器適用于各種射頻系列產(chǎn)品或標(biāo)準(zhǔn)，例如 AISG、藍(lán)牙、ISM、VHF、Wi-Fi、蜂窩、雷達(dá)、802.15.4 和 Z-Wave。此產(chǎn)品可根據(jù)調(diào)制類型和特定協(xié)議版本進(jìn)一步分類。部分 IC 包含內(nèi)置微控制器。

1 Features

Wireless microcontroller

? Powerful 48 MHz Arm? Cortex?-M33 processor

with TrustZone?

? FPU and DSP extension

? 1024 kB flash program memory

? 8 kB of cache SRAM

? 256 kB of ultra-low leakage SRAM with parity for

high-reliability operation

– 32 kB of additional SRAM is available if parity is

disabled

? Dual-band Sub-1 GHz and 2.4 GHz operation

? Dynamic multiprotocol manager (DMM) driver

? Programmable radio includes support for 2-

(G)FSK, 4-(G)FSK, MSK, OOK, IEEE 802.15.4

PHY and MAC

? Supports over-the-air upgrade (OTA)

Ultra-low power sensor controller

? Autonomous MCU with 4 kB of SRAM

? Sample, store, and process sensor data

? Fast wake-up for low-power operation

? Software defined peripherals; capacitive touch,

flow meter, LCD

Low power consumption

? MCU consumption:

– 3.4 mA active mode, CoreMark?

– 71 μA/MHz running CoreMark?

– 0.98 μA standby mode, RTC, 256 kB RAM

– 0.17 μA shutdown mode, wake-up on pin

? Ultra low-power sensor controller consumption

– 32 μA in 2 MHz mode

– 849 μA in 24 MHz mode

? Radio consumption:

– 5.8 mA RX at 868 MHz

– 6.9 mA RX at 2.4 GHz

– 22 mA TX at +10 dBm at 2.4 GHz

– 25.8 mA TX at +14 dBm at 868 MHz

– 69 mA TX at +20 dBm at 915 MHz

– 101 mA TX at +20 dBm at 2.4 GHz

Wireless protocol support

? Thread, Zigbee?, Matter

? Bluetooth? 5.3 Low Energy

? Wi-SUN?

? mioty?

? Amazon Sidewalk

? Wireless M-Bus

? SimpleLink? TI 15.4-Stack (Sub-1 GHz)

? 6LoWPAN

? Proprietary Systems

High performance radio

? Up to 130 dB link budget at 50 kbps, 868 MHz

? Up to 141 dB link budget at 2.5 kbps, 868 MHz

? –121 dBm for 2.5 kbps long-range mode

? –110 dBm at 50 kbps, 802.15.4, 868 MHz

? –104 dBm for Bluetooth? Low Energy 125 kbps

? –105 dBm for IEEE 802.15.4-2006 2.4 GHz

OQPSK (coherent modem)

? Output power up to +20 dBm with temperature

compensation

Regulatory compliance

? Designed for systems targeting compliance with

these standards:

– ETSI EN 300 220 Receiver Cat. 1.5 and 2, EN

300 328, EN 303 131, EN 303 204, EN 300 440

Cat. 2 and 3

– FCC CFR47 Part 15

– ARIB STD-T66, STD-T67 and STD-T108

MCU peripherals

? Most digital peripherals can be routed to any GPIO

? Four 32-bit or eight 16-bit general-purpose timers

? 12-bit SAR ADC, 200 ksps, 8 channels

? 8-bit DAC

? Two comparators

? Programmable current source

? Four UART, four SPI, two I2C, one I2S

? Real-time clock (RTC)

? Integrated temperature and battery monitor

Security enablers

? Supports secure boot

? Supports secure key storage and device ID

? Arm? TrustZone? for trusted execution

environment

? AES 128- and 256-bit cryptographic accelerator

? Public key accelerator

? SHA2 accelerator (full suite up to SHA-512)

? True random number generator (TRNG)

? Secure debug lock

? Software anti-rollback protection

Development tools and software

? LP-EM-CC1354P10-1 for dual-band and +20 dBm

output power on 868/915 MHz

? LP-EM-CC1354P10-6 for dual-band and +10 dBm

output power on 2.4 GHz

? LP-XDS110, LP-XDS110ET or TMDSEMU110-U

(with TMDSEMU110-ETH add-on) Debug Probe

? SimpleLink? LOWPOWER F2 Software

Development Kit (SDK)

? SmartRF? Studio for simple radio configuration

? Sensor Controller Studio for building low-power

sensing applications

? SysConfig system configuration tool

Operating range

? On-chip buck DC/DC converter

? 1.8 V to 3.8 V single supply voltage

? –40°C to +105°C

Package

? 7 mm × 7 mm RGZ VQFN48 (26 GPIOs)

? 8 mm × 8 mm RSK VQFN64 (42 GPIOs)

? RoHS-compliant package

2 Applications

? 315, 433, 470 to 510, 868, 902 to 928, and

2400 to 2480 MHz ISM and SRD systems 1

with down to 4 kHz of receive bandwidth

? Building automation

– Building security systems – motion detector,

electronic smart lock, door and window sensor,

garage door system, gateway

– HVAC – thermostat, wireless environmental

sensor, HVAC system controller, gateway

– Fire safety system – smoke and heat detector,

fire alarm control panel (FACP)

– Video surveillance – IP network camera

– Elevators and escalators – elevator main

control panel for elevators and escalators

Grid infrastructure

– Smart meters – water meter, gas meter,

electricity meter, and heat cost allocators

– Grid communications – wireless

communications – Long-range sensor

applications

– Other alternative energy – energy harvesting

Industrial transport – asset tracking

Factory automation and control

Medical

Communication equipment

– Wired networking – wireless LAN or Wi-Fi

access points, edge router

Personal electronics

– Home theater & entertainment – smart

speakers, smart display, set-top box

– Wearables (non-medical) – smart trackers,

smart clothing

3 Description

The SimpleLink? CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless

microcontroller (MCU) supporting Thread, Zigbee?, Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled

smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, including the TI 15.4-Stack

(Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver.

The device is optimized for low-power wireless communications, with advanced security features and on-chip

over-the-air (OAD) update capability. It enables long range and reliable communication in building security

systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment,

and connected peripherals markets. The highlighted features of this device include:

? Arm? TrustZone? based secure key storage, device ID and trusted functions support.

? Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM

driver.

? Wide flexibility of protocol stack support in the SimpleLink LOWPOWER F2 Software Development Kit (SDK).

? Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier

with best-in-class transmit current consumption at 64 mA for Sub-1 GHz and 101 mA for

2.4 GHz operation.

? Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA and +5 dBm at 2.4 GHz with 9.6 mA

current consumption.

? Optimized for coin-cell operation at +10 dBm at 2.4 GHz with 22 mA current consumption.

? Longer battery life wireless applications with low standby current of 0.98 μA and full RAM retention.

? Industrial temperature ready with lowest standby current of 5 μA at 85 ?C.

? Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast

wake-up capability. As an example, the sensor controller is capable of 1 Hz ADC sampling at 1 μA system

current.

? Low Soft Error Rate (SER) Failure-in-Time (FIT) for long operation lifetime with no disruption for industrial

markets with always-on SRAM parity against corruption due to potential radiation events.

? Dedicated software controlled radio controller (Arm? Cortex?-M0) providing flexible low-power RF transceiver

capability to support multiple physical layers and RF standards.

? Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink?

long-range mode.

The CC1354P10 device is part of the SimpleLink? MCU platform, which consists of Wi-Fi?, Bluetooth Low

Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development

environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the

SimpleLink? platform enables you to add any combination of the portfolio’s devices into your design, allowing

100 percent code reuse when your design requirements change. For more information, visit SimpleLink MCU

platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility

from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more

information on TIs Sub-1 GHz solutions, visit www.ti.com/sub1ghz