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首頁 >CDBQC0130L-HF>規(guī)格書列表

零件編號(hào)	下載&訂購	功能描述	制造商&上傳企業(yè)	LOGO
CDBQC0130L-HF	文件：106.64 Kbytes Page：4 Pages	Low VF SMD Schottky Barrier Diode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130L-HF	文件：100 bytes Page：1 Pages	包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶封裝/外殼：0402（1005 公制）類別：分立半導(dǎo)體產(chǎn)品二極管 - 整流器 - 單描述：DIODE SCHOTTKY 30V 100MA 0402	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0130R-HF	文件：469.34 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L	文件：200.44 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130L-HF	文件：201.65 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R	文件：200.98 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0130R-HF	文件：199.99 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：147.9 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBS0130	文件：61.59 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130	文件：65.7 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130-HF	文件：199.83 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lowstoredcharge. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130L	文件：201.72 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130L-HF	文件：201.91 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Halogenfree. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130R	文件：202.23 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Lowreversecurrent. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0130R-HF	文件：131.86 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode IO=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplate	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0130	文件：76.34 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated,solderable	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0130-HF	文件：234.7 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0130L-HF	文件：130.08 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0130R-HF	文件：130.63 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBW0130-G	文件：52.42 Kbytes Page：2 Pages	SchottkyBarrierDiode Forwardcurrent:1.0A Reversevoltage:20to40V RoHSDevice Features -Foruseinlowvoltage,highfrequencyinverters. -Freewheeling,andpolarityprotectionapplications. MechanicalData -Case:SOD-123,moldedplastic. -Terminals:solderableperMIL-STD-750,method2026. -Polari	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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產(chǎn)品屬性

產(chǎn)品編號(hào)：
CDBQC0130L-HF
制造商：
Comchip Technology
類別：
分立半導(dǎo)體產(chǎn)品 > 二極管 - 整流器 - 單
包裝：
卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶
二極管類型：
肖特基
電流 - 平均整流 (Io)：
100mA
速度：
小信號(hào) =< 200mA（Io），任意速度
不同?Vr、F 時(shí)電容：
20pF @ 1V，1MHz
安裝類型：
表面貼裝型
封裝/外殼：
0402（1005 公制）
供應(yīng)商器件封裝：
0402C/SOD-923F
工作溫度 - 結(jié)：
125°C（最大）
描述：
DIODE SCHOTTKY 30V 100MA 0402

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫存	備注	價(jià)格
上海皇華信息科技有限公司	CDBQC0130L-HF	COMCHIP	21+		96342	原裝正品,現(xiàn)貨供應(yīng)	詢價(jià)
深圳市芯祺盛科技有限公司	CDBQC0130L-HF	SXSEMI	2019+PBHF	SOD882	7318	向鴻代理渠道,有現(xiàn)貨常備料,優(yōu)勢(shì)料	詢價(jià)
深圳市粵駿騰電子科技有限公司	CDBQC0130L-HF	SXSEMI	24+	SOD882	900000	原裝進(jìn)口特價(jià)	詢價(jià)
艾睿國際（香港）有限公司	CDBQC0130L-HF	COMCHIP/典琦科技	2021+	0402CSOD-923F	100500	一級(jí)代理專營品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長期排單到貨	詢價(jià)
深圳市科雨電子有限公司	CDBQC0130L-HF	COMCHIP	1809+	SOD-923	3675	就找我吧!--邀您體驗(yàn)愉快問購元件!	詢價(jià)
深圳市宇創(chuàng)芯科技有限公司	CDBQC0130L-HF	COMCHIP/典琦科技	22+	0402CSOD-923F	9600	原裝現(xiàn)貨,優(yōu)勢(shì)供應(yīng),支持實(shí)單!	詢價(jià)
深圳市威爾健半導(dǎo)體有限公司	CDBQC0130L-HF	COMCHIP/典琦科技	23+	0402CSOD-923F	50000	全新原裝正品現(xiàn)貨,支持訂貨	詢價(jià)
深圳市易訊博科技有限公司	CDBQC0130L-HF	Comchip	22+	NA	28999	加我QQ或微信咨詢更多詳細(xì)信息,	詢價(jià)
深圳市富誠威科技有限公司	CDBQC0130L-HF	COMCHIP/典琦科技	22+	0402CSOD-923F	6200	強(qiáng)勢(shì)庫存!公司現(xiàn)貨!	詢價(jià)
深圳市寶隆宏業(yè)科技有限公司	CDBQC0130L-HF	COMCHIP/典琦科技	22+	0402CSOD-923F	19300	原裝環(huán)保托盤裝原標(biāo)簽	詢價(jià)

更多CDBQC0130L-HF供應(yīng)商更新時(shí)間2024-12-21 14:00:00

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