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CDBU0230	文件：66.04 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230-HF	文件：200.04 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230L	文件：124.06 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-523F(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230L-HF	文件：203.02 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230-N	文件：80.91 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230R	文件：121.16 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-523F(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0230R-HF	文件：201.06 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUC0230-HF	文件：100.96 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230	文件：76.86 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230-HF	文件：128.58 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowdrop-downvoltage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230L	文件：72.43 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230L-HF	文件：129.789 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230R	文件：72.39 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0230R-HF	文件：129.15 Kbytes Page：4 Pages	LowProfileSMDSchottkyBarrierDiode ForwardCurrent=200mA ReverseVoltage=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowprofilepackageis30thinnerthanstandards0603 -Majoritycarrierconduction. Mechanicalda	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBURT0230L-HF	文件：129.63 Kbytes Page：4 Pages	LowProfileSMDSchottkyBarrierDiode ForwardCurrent=200mA ReverseVoltage=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowprofilepackageis30thinnerthanstandards0603 -Majoritycarrierconduction. Mechanicalda	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBURT0230LL-HF	文件：126.54 Kbytes Page：4 Pages	LowProfileSMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBURT0230LL-HF	文件：126.54 Kbytes Page：4 Pages	LowProfileSMDSchottkyBarrierDiode ForwardCurrent=200mA RoHSDevice HalogenFree ReverseVoltage=20Volts Features -Ultralowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowprofilepackageis30thinnerthanstandards0603 -Majoritycarrierconduction. Mechani	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBURT0230R-HF	文件：129.15 Kbytes Page：4 Pages	LowProfileSMDSchottkyBarrierDiode ForwardCurrent=200mA ReverseVoltage=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowprofilepackageis30thinnerthanstandards0603 -Majoritycarrierconduction. Mechanicalda	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CER0230A	文件：71.6 Kbytes Page：2 Pages	Surfacemount,silver(Ag)coatedceramicfilter.	CTSCTS Electronic Components 西迪斯西迪斯公司	CTS
CER0230B	文件：71.65 Kbytes Page：2 Pages	Surfacemount,silver(Ag)coatedceramicfilter.	CTSCTS Electronic Components 西迪斯西迪斯公司	CTS

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供應(yīng)商	型號	品牌	批號	封裝	庫存	備注	價(jià)格
深圳市河鋒鑫科技有限公司	CDBT0230-HF整流器件	COMCHIP/典琦科技	2019+PB	SOT-23	99600	原裝正品可含稅交易	詢價(jià)
深圳市大聯(lián)智電子有限公司	CDBT0230-HF整流器件	COMCHIP/典琦科技	22+	SOT-23	354000		詢價(jià)
深圳市賽美科科技有限公司	CDBT0230-HF整流器件	COMCHIP/典琦科技	新年份	SOT-23	99600	原裝正品大量現(xiàn)貨,要多可發(fā)貨,實(shí)單帶接受價(jià)來談!	詢價(jià)
深圳市科雨電子有限公司	CDBT0540-G	COMCHIP	1809+	SOT-23-3	16750	就找我吧!--邀您體驗(yàn)愉快問購元件!	詢價(jià)
深圳市易訊博科技有限公司	CDBT0540-G	Comchip	22+	NA	75	加我QQ或微信咨詢更多詳細(xì)信息,	詢價(jià)
現(xiàn)代芯城（深圳）科技有限公司	CDBT0540-G		24+	N/A	57000	一級代理-主營優(yōu)勢-實(shí)惠價(jià)格-不悔選擇	詢價(jià)
深圳市宏捷佳電子科技有限公司	CDBT0540-G	Comchip Technology	24+	SOT-23-3	9350	獨(dú)立分銷商公司只做原裝誠心經(jīng)營免費(fèi)試樣正品保證	詢價(jià)
深圳市宏世佳電子科技有限公司	CDBT-40A-G	Comchip	2023+	SOT-23	7695	全新原廠原裝產(chǎn)品、公司現(xiàn)貨銷售	詢價(jià)
深圳市佳杰偉業(yè)科技有限公司	CDBT-40A-G	Comchip	2315+	SOT23	99500	優(yōu)勢代理渠道,原裝現(xiàn)貨,可全系列訂貨	詢價(jià)
深圳市芯福林電子科技有限公司	CDBT40SG	Comchip Technology	21+	SOT233	13880	公司只售原裝,支持實(shí)單	詢價(jià)

更多CDBT0230-HF整流器件供應(yīng)商更新時(shí)間2025-1-5 14:00:00

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