零件編號(hào) | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
CDCDB400 | CDCDB400 DB800ZL-Compliant 4-Output Clock Buffer for PCIe Gen 1 to Gen 5 | TITexas Instruments 德州儀器美國德州儀器公司 | TI | |
Marking:CDCB400;Package:VQFN;CDCDB400 DB800ZL-Compliant 4-Output Clock Buffer for PCIe Gen 1 to Gen 5 | TITexas Instruments 德州儀器美國德州儀器公司 | TI | ||
Marking:CDCB400;Package:VQFN;CDCDB400 DB800ZL-Compliant 4-Output Clock Buffer for PCIe Gen 1 to Gen 5 | TITexas Instruments 德州儀器美國德州儀器公司 | TI | ||
包裝:卷帶(TR) 封裝/外殼:32-VFQFN 裸露焊盤 類別:集成電路(IC) 時(shí)鐘緩沖器,驅(qū)動(dòng)器 描述:IC CLOCK BUFFER | TI1Texas Instruments 德州儀器 | TI1 | ||
包裝:卷帶(TR) 封裝/外殼:32-VFQFN 裸露焊盤 類別:集成電路(IC) 時(shí)鐘緩沖器,驅(qū)動(dòng)器 描述:IC CLOCK BUFFER | TI1Texas Instruments 德州儀器 | TI1 | ||
SMDSwitchingDiode Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldpla | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldpla | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode Features -Smallsurfacemountingtype. -Highspeed. -Highreliabilitywithhighsurgecurrenthandlingcapability. MechanicalData -Case:MoldedplasticSOD-723 -Terminals:SolderableperMIL-STD-750,Method2026.1. -Polarity:Indicatedbycathodeband. -Mountingposition:Any. -M | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode ReverseVoltage:80Volts ForwardCurrent:100mA Features: ?SmallSurfaceMountingType ?HighSpeed ?HighReliabilitywithHighSurgeCurrentHandlingCapability. MechanicalData: ?Case:MoldedplasticSOD-723 ?Terminals:SolderableperMIL-STD-750,Method2026.1. ?Polarity:Indica | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiodes Features -Smallsurfacemountingtype. -Highreliabilitywithhighsurgecurrent handlingcapability.. -Highspeed. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode RoHSDevice HalogenFree Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode Features -HighSpeed. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowleakagecurrent. -Highmountingcapability,strongsurgewithstand,highreliability. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplated, | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSwitchingDiode HighSpeed Features Halogenfree. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowleakagecurrent. Highmountingcapability,strongsurge withstand,highreliability. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
TI德州儀器 |
22+ |
24000 |
原裝正品現(xiàn)貨,實(shí)單可談,量大價(jià)優(yōu) |
詢價(jià) | |||
TI |
23+ |
VQFN |
5000 |
全新原裝正品現(xiàn)貨 |
詢價(jià) | ||
TI |
21+ |
DNA |
3000 |
公司現(xiàn)貨,有掛就有貨。 |
詢價(jià) | ||
TI |
22+ |
NA |
6092 |
原裝正品支持實(shí)單 |
詢價(jià) | ||
TI(德州儀器) |
23+ |
VQFN32(5x5) |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!! |
詢價(jià) | ||
TI(德州儀器) |
VQFN-32(5x5) |
原裝元器件供應(yīng)配套服務(wù)商 |
12580 |
詢價(jià) | |||
TI(德州儀器) |
23+ |
VQFN32(5x5) |
1652 |
原裝現(xiàn)貨,免費(fèi)供樣,技術(shù)支持,原廠對(duì)接 |
詢價(jià) | ||
TI/德州儀器 |
23+ |
VQFN-32(5x5) |
8355 |
只做原裝現(xiàn)貨/實(shí)單可談/支持含稅拆樣 |
詢價(jià) | ||
TI(德州儀器) |
23+ |
- |
13650 |
公司只做原裝正品,假一賠十 |
詢價(jià) | ||
Texas Instruments |
24+ |
- |
9350 |
獨(dú)立分銷商 公司只做原裝 誠心經(jīng)營 免費(fèi)試樣正品保證 |
詢價(jià) |
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