首頁>CLB1HB5301K1000TC1_V01>規(guī)格書詳情
CLB1HB5301K1000TC1_V01中文資料村田數(shù)據(jù)手冊PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多- CLB1H6U130K1000TC1
- CLB1H5C6R2K1000TC1
- CLB1HB5301K1000TC1
- CLB1H5C6R8K1000TC1
- CLB1H6U150K1000TC1
- CLB1HB5301K1000TC1
- CLB1H6U130K1000TC1
- CLB1H6U130K1000TC1_V01
- CLB1H6U150K1000TC1
- CLB1H6U150K1000TC1_V01
- CLB1H5C5R6K1000TC1_V01
- CLB1H5C6R2K1000TC1
- CLB1H5C6R2K1000TC1_V01
- CLB1H5C6R8K1000TC1
- CLB1H5C6R8K1000TC1_V01
- CLB1H5C6R2K1000TC1
- CLB1H5C6R2K1000TC1_V02
- CLB1H5C6R8K1000TC1
CLB1HB5301K1000TC1_V01規(guī)格書詳情
1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
frequency characteristics.
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
SANREX/三社 |
23+ |
MODULE |
10000 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | ||
CARLING |
23+ |
DIP |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
SANRES |
23+ |
模塊 |
450 |
全新原裝正品,量大可訂貨!可開17%增值票!價格優(yōu)勢! |
詢價 | ||
SANREX |
16+ |
2100 |
公司大量全新現(xiàn)貨 隨時可以發(fā)貨 |
詢價 | |||
SANREX |
專業(yè)模塊 |
MODULE |
8513 |
模塊原裝主營-可開原型號增稅票 |
詢價 | ||
IR |
22+ |
NA |
6000 |
終端可免費供樣,支持BOM配單 |
詢價 | ||
IR |
23+ |
NA |
8000 |
專注配單,只做原裝進口現(xiàn)貨 |
詢價 | ||
CARLING |
2022 |
DIP |
80000 |
原裝現(xiàn)貨,OEM渠道,歡迎咨詢 |
詢價 | ||
IR |
23+ |
NA |
7000 |
詢價 | |||
CIE |
2022+ |
原廠原包裝 |
6800 |
全新原裝 支持表配單 中國著名電子元器件獨立分銷 |
詢價 |