首頁(yè)>CLB3G5C130K1000TC1>規(guī)格書(shū)詳情
CLB3G5C130K1000TC1中文資料村田數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)
廠(chǎng)商型號(hào) |
CLB3G5C130K1000TC1 |
功能描述 | Microwave Integrated Circuits |
文件大小 |
180.13 Kbytes |
頁(yè)面數(shù)量 |
2 頁(yè) |
生產(chǎn)廠(chǎng)商 | Murata Manufacturing Co., Ltd |
企業(yè)簡(jiǎn)稱(chēng) |
MURATA1【村田】 |
中文名稱(chēng) | 村田制作所官網(wǎng) |
原廠(chǎng)標(biāo)識(shí) | |
數(shù)據(jù)手冊(cè) | |
更新時(shí)間 | 2025-1-18 23:00:00 |
CLB3G5C130K1000TC1規(guī)格書(shū)詳情
1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
frequency characteristics.
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
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---|---|---|---|---|---|---|---|
Littelfuse/IXYS |
23+ |
TO263 |
7350 |
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詢(xún)價(jià) | ||
IXYS |
23+ |
TO263HV |
6000 |
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詢(xún)價(jià) | ||
CONVERT/鍇威特 |
24+ |
SMD |
5000 |
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詢(xún)價(jià) | ||
SANREX |
24+ |
MODULE |
2173 |
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詢(xún)價(jià) | ||
SANREX |
專(zhuān)業(yè)模塊 |
MODULE |
8513 |
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詢(xún)價(jià) | ||
NEWINORIGINAL |
24+ |
SMD |
16200 |
新進(jìn)庫(kù)存/原裝 |
詢(xún)價(jià) | ||
TEConnectivity |
新 |
51 |
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詢(xún)價(jià) | |||
IXYS/LITTELFUSE |
2023 |
TO-263 |
2950 |
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詢(xún)價(jià) | ||
CIE |
2022+ |
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6800 |
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詢(xún)價(jià) | ||
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23+ |
MODULE |
7300 |
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詢(xún)價(jià) |