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CPD

Packaging specifications

surfacemountingtype

ROHMRohm

羅姆羅姆半導(dǎo)體集團

CPD04

General Purpose Rectifier 500 mA Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize26x26MILS DieThickness8.5MILS AnodeBondingPadArea14x14MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD05

General Purpose Rectifier 1 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize51x51MILS DieThickness10.2MILS AnodeBondingPadArea36x36MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD06

General Purpose Rectifier 3 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize89x89MILS DieThickness10.2MILS AnodeBondingPadArea66x66MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/Au-5,000?/2,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD07

General Purpose Rectifier 8 Amp Glass Passivated Rectifier Chip

PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize98x98MILS DieThickness10.4MILS AnodeBondingPadArea82.5x82.5MILS TopSideMetalizationAu-5,000? BackSideMetalizationAu-2,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD102X

Schottky Diode High Voltage Schottky Diode Chip

PROCESSDETAILS ProcessEPITAXIALPLANAR DieSize9.0x9.0MILS DieThickness5.9MILS AnodeBondingPadArea4.8MILSDIAMETER TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD104R

Schottky Diode Low VF Schottky Diode Chip

PROCESSDETAILS DieSize14.6x14.6MILS DieThickness3.9MILS AnodeBondingPadArea11.8x11.8MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD106R

Schottky Diode Chip

PROCESSDETAILS DieSize8.3x8.3MILS DieThickness3.9MILS AnodeBondingPadArea5.4x5.4MILS TopSideMetalizationAl-30,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD109R

Low VF Schottky Diode Chip

PROCESSDETAILS DieSize8.3x8.3MILS DieThickness3.9MILS AnodeBondingPadArea5.4x5.4MILS TopSideMetalizationAl-20,000? BackSideMetalizationAu-12,000?

CentralCentral Semiconductor Corp

美國中央半導(dǎo)體

CPD1415B

Inductor for Digital AMP

Features： Corematerial:Ferrite Coreandwindingloss: www.codaca.com/DesignTool_Power-Inductor-Loss-Comparison.html Environmental:RoHScompliant,halogenfree Weight:13.05g MoistureSensitivity:Level(MSL)1 (unlimitedfloorlifeat

CODACAShenzhen Codaca Electronic Co.,Ltd

科達嘉電子深圳市科達嘉電子有限公司

詳細參數(shù)

  • 型號：

    CPD

  • 制造商：

    ROHM

  • 制造商全稱：

    Rohm

  • 功能描述：

    Packaging specifications

供應(yīng)商型號品牌批號封裝庫存備注價格
INTERSIL
94+
SOP20
3600
全新原裝進口自己庫存優(yōu)勢
 詢價
RCA
1991
31
原裝正品現(xiàn)貨庫存價優(yōu)
 詢價
ACER
24+
TSSOP
3020
詢價
Comchip
2020+
WBFBP-0
20000
百分百原裝正品 真實公司現(xiàn)貨庫存 本公司只做原裝 可
 詢價
CP
2015+
SOP
19889
一級代理原裝現(xiàn)貨,特價熱賣!
 詢價
AVNET
13+
DIP-2
38488
原裝分銷
 詢價
Comchip
23+
SOT-363
7750
全新原裝優(yōu)勢
 詢價
COMCHP
2016+
SOD-523
3500
只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
 詢價
ACER
24+
TSSOP
3500
原裝現(xiàn)貨,可開13%稅票
 詢價
原裝COMCHIP
24+
WBFBP-02C-C
5000
全現(xiàn)原裝公司現(xiàn)貨
 詢價
更多CPD供應(yīng)商 更新時間2025-2-24 8:00:00

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