首頁(yè) >CPDQC3V3HT-HF>規(guī)格書(shū)列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
CPDQC3V3HT-HF | Marking:E3T;Package:SOD-923F;SMD ESD Protection Diode Features -UltrasmallSMDpackage:0402C. -IEC61000-4-2Level4ESDprotection. -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | |
CPDQC3V3HT-HF | 包裝:卷帶(TR) 封裝/外殼:0402(1006 公制) 類(lèi)別:電路保護(hù) TVS - 二極管 描述:DIODE ESD 3.3VWM 5.5VC 0402C/SOD | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | |
BIDIRECTIONALTVSDIODE Features Protectsonedataline Ultralowleakage:nAlevel Operatingvoltage:3.3V Ultralowclampingvoltage Complieswithfollowingstandards: –IEC61000-4-2(ESD)immunitytest Airdischarge:±30kV Contactdischarge:±30kV –IEC61000-4-5(Lightning)8A(8/20μs) RoHSCompliant App | LEIDITECHShanghai Leiditech Electronic Technology Co., Ltd 雷卯電子上海雷卯電子科技有限公司 | LEIDITECH | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0402C. -Highcomponentdensity. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -UltrasmallSMDpackage:0402C. -Uni-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0402. -Highcomponentdensity. Mechanicaldata -Case:0402/SOD-923standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:E3 -Mounti | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage:0402. -Highcomponentdensity. Mechanicaldata -Case:0402/SOD-923standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -IEC61000-4-2Level4ESDprotection. -ESDRatingofClass3perHumanBodyMode. -LowLeakage -ResponseTimeisTypically Mechanicaldata -Case:0402/SOD-882smalloutlineplasticpackage. -Terminals:Mattetinplated,solderableperMIL-STD-750, | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features IEC61000-4-2(ESD)±15kV(Contact),±20kV(Air). Workingvoltage:3.3V Lowleakagecurrent. Lowoperatingandclampingvoltages. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-750,method2026. Mou | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Workingvoltage:3.3V -Lowleakagecurrent. -Lowoperatingandclampingvoltages. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Markingcode:E3V3 -Mountin | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Bi-directionalESDprotection. -Surfacemountpackage. -Lowleakagecurrent. -Highcomponentdensity. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Mountin | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowCapacitanceSMDESDProtectionDiode RoHSDevice HalogenFree Features -ProtectsoneBi-directionalI/Oline -WorkingVoltage:3V,3.3V,5V,8V,12V,15V,24V -Lowclampingvoltage -IEC61000-4-2Level4ESDProtection. -IEC61000-4-4Level4FETprotection. -IEC61000-4-5(Lightning)rating.12A(8/20μS) Mechanicaldata -Cas | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -UltrasmallSMDpackage. -Highcomponentdensity. -Lowclampingvoltage. -Lowleakage. Mechanicaldata -Case:0201/DFN0603package,moldedplastic. -Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiodenull | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowclampingvoltage. -Lowleakagecurrent. -IEC61000-4-2(ESD);±20KV(contact) -IEC61000-4-5(surge);Ipp=4A -UltrasmallSMDpackage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
產(chǎn)品屬性
- 產(chǎn)品編號(hào):
CPDQC3V3HT-HF
- 制造商:
Comchip Technology
- 類(lèi)別:
電路保護(hù) > TVS - 二極管
- 包裝:
卷帶(TR)
- 類(lèi)型:
齊納
- 電壓 - 反向斷態(tài)(典型值):
3.3V(最大)
- 電壓 - 擊穿(最小值):
3.7V
- 不同 Ipp 時(shí)電壓 - 箝位(最大值):
7V(標(biāo)準(zhǔn))
- 電流 - 峰值脈沖 (10/1000μs):
17A(8/20μs)
- 功率 - 峰值脈沖:
119W
- 電源線路保護(hù):
無(wú)
- 應(yīng)用:
通用
- 不同頻率時(shí)電容:
38pF @ 1MHz
- 工作溫度:
-55°C ~ 125°C(TJ)
- 安裝類(lèi)型:
表面貼裝型
- 封裝/外殼:
0402(1006 公制)
- 供應(yīng)商器件封裝:
0402C/SOD-923F
- 描述:
DIODE ESD 3.3VWM 5.5VC 0402C/SOD
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
24+ |
N/A |
69000 |
一級(jí)代理-主營(yíng)優(yōu)勢(shì)-實(shí)惠價(jià)格-不悔選擇 |
詢(xún)價(jià) | |||
Comchip |
1742+ |
0402CSOD-923F |
98215 |
只要網(wǎng)上有絕對(duì)有貨!只做原裝正品! |
詢(xún)價(jià) | ||
COMCHIP/典琦科技 |
24+ |
SOD923 |
900000 |
原裝進(jìn)口特價(jià) |
詢(xún)價(jià) | ||
COMCHIP |
20+ |
SOD-923 |
6985 |
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件! |
詢(xún)價(jià) | ||
Comchip |
22+ |
NA |
3356 |
加我QQ或微信咨詢(xún)更多詳細(xì)信息, |
詢(xún)價(jià) | ||
Comchip/典琦科技 |
22+ |
0402CSOD-923F |
25000 |
只有原裝原裝,支持BOM配單 |
詢(xún)價(jià) | ||
COMCHIP/典琦科技 |
23+ |
12000 |
詢(xún)價(jià) | ||||
Comchip |
24+ |
5000 |
只做原裝公司現(xiàn)貨 |
詢(xún)價(jià) | |||
comchip |
18+ |
85600 |
保證進(jìn)口原裝可開(kāi)17%增值稅發(fā)票 |
詢(xún)價(jià) | |||
COMCHIP/典琦科技 |
2021+ |
2020 |
100500 |
一級(jí)代理專(zhuān)營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢(xún)價(jià) |
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