CSTNE13M5G520000R0_V01中文資料村田數(shù)據(jù)手冊PDF規(guī)格書

MURATA's package technology expertise has enabled the

development of the Chip CERALOCK.

High-density mounting is made possible by the small package

and the elimination of the need for an external load capacitor.

Features

1. Oscillation circuits do not require external load capacitors.

2. Available for a wide frequency range.

3. Extremely small and have a low profile.

4. No adjustment is necessary for oscillation circuits.

5. Stable supply is ensured due to not using precious

metal(Palladium).